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Package diagrams – Cypress CY62128B User Manual

Page 9

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CY62128B

MoBL

®

Document #: 38-05300 Rev. *C

Page 9 of 11

Package Diagrams

0.546[13.868]

0.440[11.176]

0.101[2.565]

0.050[1.270]

0.014[0.355]

0.118[2.997]

0.004[0.102]

0.047[1.193]

0.006[0.152]

0.023[0.584]

0.793[20.142]

0.450[11.430]

0.566[14.376]

0.111[2.819]

0.817[20.751]

BSC.

0.020[0.508]

MIN.

MAX.

0.012[0.304]

0.039[0.990]

0.063[1.600]

SEATING PLANE

1

16

17

32

0.004[0.102]

32-Lead (450 MIL) Molded SOIC S34

51-85081-*B

51-85056-*D

32-Lead Thin Small Outline Package Type I (8x20 mm) Z32

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