Cypress CY7C1410JV18 - Manual (Page 25)

CY7C1410JV18, CY7C1425JV18
CY7C1412JV18, CY7C1414JV18
Document #: 001-12561 Rev. *D Page 25 of 26
Package Diagram
Figure 4. 165-ball FBGA (15 x 17 x 1.40 mm), 51-85195
A
1
PIN 1 CORNER
17.00±0.10
15.00±0.10
7.00
1.00
Ø0.50 (165X)
Ø0.25 M C A B
Ø0.05 M C
B
A
0.15(4X)
0.35±0.06
1.40
MAX.
SEATING PLANE
0.53±0.05 0.25
C
0.15
C
PIN 1 CORNER TOP VIEW BOTTOM VIEW
2 3 4 5 6 7 8 9 10
10.00
14.00
B
C
D
E
F
G
H
J
K
L
M
N
11 11 10 9 8 6 7 5 4 3 2 1
P
R
P
R
K
M
N
L
J
H
G
F
E
D
C
B
A
C
1.00
5.00
0.36
+0.14
-0.06
SOLDER PAD TYPE : NON SOLDER MASK DEFINED (NSMD)
NOTES :
PACKAGE WEIGHT : 0.65g
JEDEC REFERENCE : MO-216 / DESIGN 4.6C
PACKAGE CODE : BB0AD
51-85195-*A
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