Digilent 210-203P-BOARD - Manual (Page 4)

JTAG-SMT1 Programming Module for Xilinx® FPGAs
Copyright Digilent, Inc. All rights reserved.
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Page 4 of 5
Mounting to Host PCBs
The JTAG-SMT1 module has a moisture sensitivity level (MSL) of 6. Prior to reflow, the JTAG-SMT1 module must be
dried by baking it at 125° C for 17 hours. Once this process has been completed, the module has a MSL of 3 and is
suitable for reflow for up to 168 hours without additional drying.
SMT1 signal pads are finished with the ENIG process using 2u” gold over 150u” electroless nickel. The SMT1 is
compatible with most mounting and reflow processes. The binding force of the solder is sufficient to hold the
SMT1 firmly in place; no additional adhesives are required.
0
50
100
150
200
250
300
-15 5 25 45 65 85 105 125 145 165 185 205 225 245 265 285 305 325 345 365 385
R
ef
low
T
emp.
(
o
C)
Reflow Time (s)
JTAG SMT1 Profile
Symbol Parameter Min Max
T
CK
T
CK
period 33ns 2.185ms
T
CKH
, T
CKL
T
CLK
pulse width 20ns 1.1ms
T
CD
T
CLK
to TMS, TDI 0 15ns
T
SU
TDO Setup time 19ns
T
HD
TDO Hold time 0
TMS/TDI
TCK
TDO
T
CKL
T
CKH
T
CK
T
CD
T
SU
T
HD