Cypress enCoRe CY7C64215 - Manual (Page 28)

CY7C64215
Document 38-08036 Rev. *C Page 28 of 30
Figure 10. 28-Pin Shrunk Small Outline Package
Thermal Impedance
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 27. Thermal Impedance for the Package
Package Typical
θ
JA
*
56 Pin MLF 20 o C/W
28 Pin SSOP 96
o
C/W
* T
J
= T
A
+ POWER x
θ
JA
51-85079-*C
Table 28. Solder Reflow Peak Temperature
Package Minimum Peak Temperature* Maximum Peak Temperature
56 Pin MLF 240°C 260°C
28 Pin SSOP 240°C 260°C
*Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220±5°C with
Sn-Pb or 245±5°C with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.
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