Chemtronics Soder-Wick Unfluxed SD 75-4-10 - Manual

PRODUCT DESCRIPTION
Soder-Wick

offers the state of the art in
desoldering technology. Soder-Wick

is
designed for today’s heat sensitive
electronic components using lighter mass,
pure copper braid construction that allows
for better thermal conductivity, even at low
temperatures. Soder-Wick

responds faster
than conventional desoldering braids
thereby minimizing overheating and
preventing PCB damage. A full range of
sizes and flux types are available, including
Rosin, No Clean, unfluxed and a high
temperature Lead-Free version. Whatever
the requirement, Soder-Wick

has the
answer.
 Requires little or no post solder cleaning
 No corrosive residues
 Optimized construction for faster
wicking and heat transfer
 Halide free
 Minimizes the risk of heat damage to
components and circuit boards
TYPICAL APPLICATIONS
Soder-Wick

desoldering braid safely
removes solder from:
 Thru-hole Components
 SMT Pads and BGA Pads
 Micro Circuits
 Terminals
 Lugs and Posts
 Identification Script
TYPICAL PRODUCT DATA AND
PHYSICAL PROPERTIES
Flux Types: Rosin Grade WW, Type “R”
Patented No Clean
High Temperature No Clean
Specifications: ANSI/IPC J STD-004
MIL-F-14256 F
No Clean Flux Spec: MIL-STD-883B
Bellcore TR-NWT-000078
ANSI/IPC J SF818
Shelflife: 2 years
Size #
Width
Inches Color
Width
Metric
1 .030” White 0.8mm
2 .060” Yellow 1.5mm
3 .080” Green 2.0mm
4 .110” Blue 2.8mm
5 .145” Brown 3.7mm
6 .210” Red 5.3mm
BGA - Purple -
STATIC DISSIPATIVE PACKAGING
Soder-Wick

SD is packaged on Static
Dissipative bobbins in 5 and 10-foot lengths
to minimize the risk of damage associated
with static electricity. The static dissipative
bobbins qualify as electrostatic discharge
protective per MIL-STD-1686C and MIL-
HDBK-263B, and meet the static delay rate
provision of MIL-B-81705C.
TDS # SWick
CHEMTRONICS
Technical Data Sheet
Soder-Wick

Desoldering Braid