Chemtronics Chemask® NA – Non-Ammoniated CNA8 - Manual

PRODUCT DESCRIPTION
Chemask

NA Non-Ammoniated Solder
Masking Agent is a fast curing, peelable
temporary spot mask formulated for safe use on
sensitive metals. It contains high-temperature
resistant compounds that protect component-free
areas during wave soldering. Chemask

NA may
be used to protect pins, posts, contacts and edge
connections in the solder reflow oven or during
conformal coating processes.

Stable to 550

F (288

C)

For lead-free or tin/lead processes

Phthalate-free, low toxicity and
environmentally safe

Compatible with rosin, water soluble fluxes
and cleaning solvents

Dries tack free in 15 minutes

Goes straight into the pre-heat oven

Removes easily and leaves no residue

Non-contaminating, non-staining and non-
corrosive

Compatible with gold, copper, nickel, silver
and OSP finishes

RoHS compliant
TYPICAL APPLICATIONS
Chemask

NA protects:
 Protects component-free areas during wave
and reflow soldering
 Components and pin connectors
 Temperature sensitive components during
wave or reflow soldering
TYPICAL PRODUCT DATA AND
PHYSICAL PROPERTIES
Base Material Synthetic Resin
Color Green
Odor Odorless
Flux Compatibility All Types
Process Compatibility Wave soldering
& Reflow
Solder Compatibility Lead-free & Tin/Lead
Temperature Stability 550

F
Tack-Free Drying Time
(10 mils @ 77

F)
15 min.
Cure Time
(10 mils @ 77

F)
30 min.
Viscosity @ 77

F 200,000 cps
Viscosity Adjusted With DI water
Flash Point Nonflammable
Weight/Gallon 8.5 lbs.
Shelflife 2 years
RoHS compliant Yes
COMPATIBILITY
Chemask

NA is generally compatible with most
materials used in printed circuit board
fabrication. As with any solder masking agent,
compatibility
with substrate should be
determined on a non-critical area prior to use.
TDS# CNA8
CHEMTRONICS
Technical Data Sheet
Chemask

NA
High Temperature Solder Masking Agent
The high temperature, peelable, temporary mask safe for use on sensitive metals