Chemtronics Chemask® LF - Lead-Free CLF8 User Manual
Technical data sheet, Chemask, Lead-free solder masking agent
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PRODUCT DESCRIPTION
Chemask
Lead-Free Solder Masking Agent
is a temporary, fast curing, peelable solder
masking agent formulated for use in high
temperature lead-free applications. It is a
temperature resistant coating that protects
component-free areas of the PCB during
wave soldering. Chemask
Lead-Free can
be introduced into the preheat oven within 4
minutes of application without adverse
effects. Use to protect pins, posts, contacts
and edge connections during conformal
coating processes.
Stable to 550
°F (288°C)
Can be used in lead-free or Tin/Lead
applications
Compatible with rosin, no clean, and
water soluble fluxes
Unaffected by cleaning solvents
Leaves no residue – non-contaminating
Ready for wave solder in 4 minutes
Dries tack free in 15 minutes
RoHS compliant
TYPICAL APPLICATIONS
Chemask
Lead-Free Solder Masking Agent
protects:
Component Free Areas for Soldering
Components and Sockets
Pin Connectors During Soldering
Temperature Sensitive Components
During Wave Soldering
TYPICAL PRODUCT DATA AND
PHYSICAL PROPERTIES
Base Material
Natural latex rubber
Color
Pink
Solvent Stability Stable in all hydrocarbon,
(cured mask) hydrofluorocarbon, chlorinated,
and halogenated solvents
Flux Compatibility
All types
Temperature Stability
550
°F
Tack-Free Drying Time
(10 mils @ 77
°F)
15 min.
Cure Time
(10 mils @ 77
°F)
30 min.
Viscosity (@ 77
°F)
(
± 10,000 cps)
190,000 cps
Viscosity Adjusted With Deionized water
Solids Content
~ 80%
Flash Point
Nonflammable
Weight/Gallon
7.2 lbs.
Shelflife 2 years
COMPATIBILITY
Chemask
Lead-Free Solder Masking Agent
is generally compatible with most materials
used in printed circuit board fabrication. As
with any solder masking agent, compatibility
with substrate must be determined on a non-
critical area prior to use. Test compatibility
on bare copper.
TDS # CLF8
CHEMTRONICS
Technical Data Sheet
Chemask
Lead-Free Solder Masking Agent