Chemtronics Soder-Wick No Clean SD SW16055 - Manual

PRODUCT DESCRIPTION
Soder-Wick

No Clean is designed to
provide fast and safe desoldering without
leaving behind harmful flux residues.
Soder-Wick

No Clean uses pure, oxygen
free copper braid and a patented flux
technology to make an efficient and
effective desoldering braid. Soder-Wick

No Clean SD is available on ESD safe
bobbins for protection against damage due
to static electricity.
 Requires little or no post solder cleaning
 No corrosive residues
 Halide free
 ESD Safe bobbins meet specs:
MIL-STD-1686C
MIL-HDBK-263B
Static decay provision of
MIL-B-81705C
 Minimal risk of heat and static
component damage
TYPICAL APPLICATIONS
Soder-Wick

No Clean safely removes
solder from:
 Lugs and Posts
 Micro Circuits
 Surface Mount Device Pads
 Ball Grid Array Pads
TYPICAL PRODUCT DATA AND
PHYSICAL PROPERTIES
Surface Insulation Resistance
Bellcore TR-NWT-000078 : PASS
After 96 Hours (megohms) 2 x 10
4
Limit
Group A Group B Group C
4.8 x 10
6
3.8 x 10
6
4.1 x 10
6
ANSI/IPC J SF-818 : PASS
After 168 Hours (ohms) 1.8 x 10
8
Limit
1-2 2-3 3-4 4-5
2.3 x 10 10 2.6 x 10 10 2.8 x 10 10 2.8 x 10 10
Electromigration : PASS
Average Insulation Resistance
(megohms)-One Decade Limit
Initial Final
Group E 3.93 x 10
3
1.24 x 10
4
Group F 3.87 x 10
3
2.84 x 10
4
At 10x magnification no evidence of
electromigration or heavy corrosion.
Silver Chromate Test Paper PASS
Copper Mirror Test PASS
Shelflife 2 years
SODER-WICK

NO CLEAN MEETS OR
EXCEEDS:
MIL-F-14256F, Type R
DOD-STD-883E, Method 2022
Bellcore TR-NWT-000078
ANSI/IPC J SF-818
TDS # SWNoClean
CHEMTRONICS
Technical Data Sheet
Soder-Wick

No Clean
Desoldering Braid