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Cypress CY62137FV30 User Manual

Features, Functional description, Logic block diagram

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Cypress Semiconductor Corporation

198 Champion Court

San Jose

,

CA 95134-1709

408-943-2600

Document Number: 001-07141 Rev. *F

Revised January 2, 2008

CY62137FV30 MoBL

®

2-Mbit (128K x 16) Static RAM

Features

Very high speed: 45 ns

Temperature ranges

Industrial: –40°C to +85°C

Automotive-A: –40°C to +85°C

Automotive-E: –40°C to +125°C

Wide voltage range: 2.20V–3.60V

Pin compatible with CY62137CV/CV25/CV30/CV33,
CY62137V, and CY62137EV30

Ultra low standby power

Typical standby current: 1

μA

Maximum standby current: 5

μA (Industrial)

Ultra low active power

Typical active current: 1.6 mA at f = 1 MHz (45 ns speed)

Easy memory expansion with CE and OE features

Automatic power down when deselected

CMOS for optimum speed and power

Byte power down feature

Available in Pb free 48-Ball VFBGA and 44-pin TSOP II
package

Functional Description

The CY62137FV30 is a high performance CMOS static RAM
organized as 128K words by 16 bits. This device features
advanced circuit design to provide ultra low active current. This

is ideal for providing More Battery Life™ (MoBL

®

) in portable

applications such as cellular telephones. The device also has an
automatic power down feature that significantly reduces power
consumption by 90% when addresses are not toggling. Placing
the device into standby mode reduces power consumption by
more than 99% when deselected (CE HIGH or both BLE and
BHE are HIGH). The input and output pins (IO

0

through IO

15

) are

placed in a high impedance state in the following conditions:

Deselected (CE HIGH)

Outputs are disabled (OE HIGH

Both Byte High Enable and Byte Low Enable are disabled
(BHE, BLE HIGH)

Write operation is active (CE LOW and WE LOW)

Write to the device by taking Chip Enable (CE) and Write Enable
(WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data
from IO pins (IO

0

through IO

7

) is written into the location

specified on the address pins (A

0

through A

16

). If Byte High

Enable (BHE) is LOW, then data from IO pins (IO

8

through IO

15

)

is written into the location specified on the address pins (A

0

through A

16

).

Read from the device by taking Chip Enable (CE) and Output
Enable (OE) LOW, while forcing the Write Enable (WE) HIGH. If
Byte Low Enable (BLE) is LOW, then data from the memory
location specified by the address pins appear on IO

0

to IO

7

. If

Byte High Enable (BHE) is LOW, then data from memory
appears on IO

8

to IO

15

. See the

“Truth Table”

on page 9 for a

complete description of read and write modes.

For best practice recommendations, refer to the Cypress
application note

AN1064, SRAM System Guidelines

.

128K x 16

RAM Array

IO

0

–IO

7

ROW D

E

COD

E

R

A

8

A

7

A

6

A

5

A

2

COLUMN DECODER

A

11

A

12

A

13

A

14

A

15

S

E

NS

E AMPS

DATA IN DRIVERS

OE

A

4

A

3

IO

8

–IO

15

CE

WE

BHE

A

16

A

0

A

1

A

9

A

10

BLE

BHE
BLE

CE

POWER DOWN

CIRCUIT

Logic Block Diagram

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