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Package diagrams, Continued), Feedback – Cypress CY7C1380FV25 User Manual

Page 28

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CY7C1380DV25, CY7C1380FV25
CY7C1382DV25, CY7C1382FV25

Document #: 38-05546 Rev. *E

Page 28 of 29

© Cypress Semiconductor Corporation, 2006-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the
use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to
be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

Intel and Pentium are registered trademarks, and i486 is a trademark of Intel Corporation. All product and company names

mentioned in this document are the trademarks of their respective holders.

Figure 3. 165-Ball FBGA (13 x 15 x 1.4 mm) (51-085180)

Package Diagrams

(continued)

A

1

PIN 1 CORNER

15.00±0.10

13.00±0.10

7.00

1.00

Ø0.50 (165X)

Ø0.25 M C A B

Ø0.05 M C

B

A

0.15(4X)

0.35±0.06

SEATING PLANE

0.53±0.05

0.25

C

0.15

C

PIN 1 CORNER

TOP VIEW

BOTTOM VIEW

2

3

4

5

6

7

8

9

10

10.00

14.00

B

C

D

E

F

G

H

J

K

L

M

N

11

11

10

9

8

6

7

5

4

3

2

1

P

R

P

R

K

M

N

L

J

H

G

F

E

D

C

B

A

A

15.00±0.10

13.00±0.10

B

C

1.00

5.00

0.36

-0.06
+0.14

1.40

MAX.

SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)

NOTES :

PACKAGE WEIGHT : 0.475g

JEDEC REFERENCE : MO-216 / DESIGN 4.6C

PACKAGE CODE : BB0AC

51-85180-*A

165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D

A

1

PIN 1 CORNER

15.00±0.10

13.00±0.10

7.00

1.00

Ø0.50 (165X)

Ø0.25 M C A B

Ø0.05 M C

B

A

0.15(4X)

0.35±0.06

SEATING PLANE

0.53±0.05

0.25 C

0.15 C

PIN 1 CORNER

TOP VIEW

BOTTOM VIEW

2

3

4

5

6

7

8

9

10

10.00

14.00

B

C

D

E

F

G

H

J

K

L

M

N

11

11

10

9

8

6

7

5

4

3

2

1

P

R

P

R

K

M

N

L

J

H

G

F

E

D

C

B

A

A

15.00±0.10

13.00±0.10

B

C

1.00

5.00

0.36

-

0.06

+0.14

1.40 MAX.

SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)

NOTES :

PACKAGE WEIGHT : 0.475g

JEDEC REFERENCE : MO-216 / DESIGN 4.6C

PACKAGE CODE : BB0AC

51-85180-*A

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