Cypress CY7C1380FV25 - Manual (Page 18)

CY7C1380DV25, CY7C1380FV25
CY7C1382DV25, CY7C1382FV25
Document #: 38-05546 Rev. *E Page 18 of 29
Capacitance [18]
Parameter Description Test Conditions
100 TQFP
Package
119 BGA
Package
165 FBGA
Package Unit
C
IN
Input Capacitance T
A
= 25 °C, f = 1 MHz,
V
DD
/V
DDQ
= 2.5V
5 8 9 pF
C
CLK
Clock Input Capacitance 5 8 9 pF
C
IO
Input/Output Capacitance 5 8 9 pF
Thermal Resistance [18]
Parameter Description Test Conditions
100 TQFP
Package
119 BGA
Package
165 FBGA
Package Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Test conditions follow standard
test methods and procedures for
measuring thermal impedance,
in accordance with
EIA/JESD51.
28.66 23.8 20.7 °C/W
Θ
JC
Thermal Resistance
(Junction to Case)
4.08 6.2 4.0 °C/W
AC Test Loads and Waveforms
OUTPUT
R = 1667 Ω
R = 1538 Ω
5 pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50 Ω
Z
0
= 50 Ω
V
T
= 1.25V
2.5V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤ 1 ns ≤ 1 ns
(c)
2.5V IO Test Load
Note:
18. Tested initially and after any design or process change that may affect these parameters.
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