Package diagrams, Continued), Feedback – Cypress Perform CY7C1380F User Manual
Page 32
CY7C1380D, CY7C1382D
CY7C1380F, CY7C1382F
Document #: 38-05543 Rev. *F
Page 32 of 34
Figure 16. 165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180)
Package Diagrams
(continued)
A
1
PIN 1 CORNER
15.00±0.10
13.00±0.10
7.00
1.00
Ø0.50 (165X)
Ø0.25 M C A B
Ø0.05 M C
B
A
0.15(4X)
0.35±0.06
SEATING PLANE
0.53±0.05
0.25
C
0.15
C
PIN 1 CORNER
TOP VIEW
BOTTOM VIEW
2
3
4
5
6
7
8
9
10
10.00
14.00
B
C
D
E
F
G
H
J
K
L
M
N
11
11
10
9
8
6
7
5
4
3
2
1
P
R
P
R
K
M
N
L
J
H
G
F
E
D
C
B
A
A
15.00±0.10
13.00±0.10
B
C
1.00
5.00
0.36
-0.06
+0.14
1.40
MAX.
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
NOTES :
PACKAGE WEIGHT : 0.475g
JEDEC REFERENCE : MO-216 / DESIGN 4.6C
PACKAGE CODE : BB0AC
51-85180-*A
165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D
A
1
PIN 1 CORNER
15.00±0.10
13.00±0.10
7.00
1.00
Ø0.50 (165X)
Ø0.25 M C A B
Ø0.05 M C
B
A
0.15(4X)
0.35±0.06
SEATING PLANE
0.53±0.05
0.25 C
0.15 C
PIN 1 CORNER
TOP VIEW
BOTTOM VIEW
2
3
4
5
6
7
8
9
10
10.00
14.00
B
C
D
E
F
G
H
J
K
L
M
N
11
11
10
9
8
6
7
5
4
3
2
1
P
R
P
R
K
M
N
L
J
H
G
F
E
D
C
B
A
A
15.00±0.10
13.00±0.10
B
C
1.00
5.00
0.36
-
0.06
+0.14
1.40 MAX.
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
NOTES :
PACKAGE WEIGHT : 0.475g
JEDEC REFERENCE : MO-216 / DESIGN 4.6C
PACKAGE CODE : BB0AC
51-85180-*A