Package drawings, Cs5530, 20 pin ssop package drawing – Cirrus Logic CS5530 User Manual
Page 34
CS5530
34
DS742F3
5. PACKAGE DRAWINGS
Notes: 1. “D” and “E1” are reference datums and do not included mold flash or protrusions, but do include mold
mismatch and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per
side.
2. Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be
0.13 mm total in excess of “b” dimension at maximum material condition. Dambar intrusion shall not
reduce dimension “b” by more than 0.07 mm at least material condition.
3. These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.
INCHES
MILLIMETERS
NOTE
DIM
MIN
MAX
MIN
MAX
A
--
0.084
--
2.13
A1
0.002
0.010
0.05
0.25
A2
0.064
0.074
1.62
1.88
b
0.009
0.015
0.22
0.38
2,3
D
0.272
0.295
6.90
7.50
1
E
0.291
0.323
7.40
8.20
E1
0.197
0.220
5.00
5.60
1
e
0.024
0.027
0.61
0.69
L
0.025
0.040
0.63
1.03
∝
0°
8°
0°
8°
20 PIN SSOP PACKAGE DRAWING
E
N
1 2 3
e
b
2
A1
A2
A
D
SEATING
PLANE
E1
1
L
SIDE VIEW
END VIEW
TOP VIEW
∝
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