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4 power supply characteristics, 5 thermal data (48-pin lqfp) – Cirrus Logic CS485xx User Manual

Page 10

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10

DS734F5

5.4 Power Supply Characteristics

5.4 Power Supply Characteristics

(Measurements performed under operating conditions)

5.5 Thermal

Data (48-pin LQFP)

Parameter

Symbol

Min

Typ

Max

Unit

High-level input voltage

V

IH

2.0

V

Low-level input voltage, except XTI

V

IL

0.8

V

Low-level input voltage, XTI

V

ILXTI

0.6

V

Input hysteresis

V

hys

0.4

V

High-level output voltage (I

O

= –2 mA), except XTI

V

OH

VDDIO*0.9

V

Low-level output voltage (I

O

= 2 mA), except XTI

V

OL

VDDIO*0.1

V

Input leakage XTI

I

LXTI

5

µA

Input leakage current (all digital pins with internal pull-up resistors enabled)

I

LEAK

70

µA

Parameter

Min

Typ

Max

Unit

Operational Power Supply Current:

VDD: Core and I/O operating

1

1.Dependent on application firmware and DSP clock speed.

203

mA

VDDA: PLL operating

8

mA

VDDIO: With most ports operating

27

mA

Total Operational Power Dissipation:

480

mW

Standby Power Supply Current:

VDD: Core and I/O not clocked

100

µA

VDDA: PLL halted

1

µA

VDDIO: All connected I/O pins 3-stated by other ICs in system

50

µA

Total Standby Power Dissipation

348

µW

Parameter

Symbol

Min

Typ

Max

Unit

Junction Temperature

T

j

125

°C

Thermal Resistance (Junction to Ambient)

Two-layer board

1

Four-layer board

2

1.Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1 oz. copper covering 20% of the top and bottom layers.
2.Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1 oz. copper covering 20% of the top and bottom layers and 0.5

oz. copper covering 90 % of the internal power plane and ground plane layers.

θ

ja

63.5

°C/Watt

54

Thermal Resistance (Junction to Top of Package)

Two-layer board

3

Four-layer board

4

3.To calculate the die temperature for a given power dissipation

T

j

= Ambient Temperature + [(Power Dissipation in Watts)*

θ

ja

]

4.To calculate the case temperature for a given power dissipation

T

c

=

T

j

– [(Power Dissipation in Watts)*

ψ

jt

]

ψ

jt

0.70

°C/Watt

0.64