Teledyne LeCroy ZS2500 - Manual (Page 13)

Operator’s Manual
Grounds
Offset Ground The offset pin is designed to be attached to either socket
of the probe head. The offset pin is the highest quality
grounding solution and is recommended in high
frequency applications.
The offset ground is designed to connect to the ground
socket and wrap around the probe head. This gives the
ability to a probe signal and ground that are extremely
close together. The short length provides high-quality
grounding for high-frequency applications.
Ground Blade
(narrow) and
Copper Pad
The Ground Blade and Copper Pad are intended to work
together for the best grounding solution for probing an
IC. The Ground Blade is designed to provide a short, low
inductance ground path. The Copper Pad is adhesive
backed to stick to the top of an IC, and can then be
soldered to the IC ground.
Ground Blade (wide) The wide ground blade is ideal for use when the best
quality ground is needed. The wide blade offers the
minimal inductance compared to the narrow ground
blade.
924282-00 Rev A 7