Transient voltage suppression diodes, Surface mount – 500w > sacb series – Littelfuse SACB Series User Manual
Page 3

Transient Voltage Suppression Diodes
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/20/14
Surface Mount – 500W > SACB series
Physical Specifications
Weight
0.003oz., 0.093g
Case
JEDEC DO-214AA molded plastic body
over glass passivated junction.
Polarity
Color band denotes cathode except
Bidirectional
Terminal
Matte Tin-plated leads. Solderable per
JESD22-B102.
Dimensions
Soldering Parameters
Te
mperature (T
)
Time (t)
T
s(min)
T
s(max)
T
L
T
P
t
s
Preheat
t
L
t
p
Ramp-up
Critical Zone
T
L
to T
P
Ramp-down
t 25˚C to Peak
25˚C
Reflow Condition
Lead–free assembly
Pre Heat
- Temperature Min (T
s(min)
)
150°C
- Temperature Max (T
s(max)
)
200°C
- Time (min to max) (t
s
)
60 – 180 secs
Average ramp up rate (Liquidus Temp
(T
L
) to peak
3°C/second max
T
S(max)
to T
L
- Ramp-up Rate
3°C/second max
Reflow
- Temperature (T
L
) (Liquidus)
217°C
- Time (min to max) (t
s
)
60 – 150 seconds
Peak Temperature (T
P
)
260
+0/-5
°C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (T
P
)
8 minutes Max.
Do not exceed
280°C
Flow/Wave Soldering (Solder Dipping)
Peak Temperature :
265
O
C
Dipping Time :
10 seconds
Soldering :
1 time
A
D
E
G
F
H
C
B
Cathode Band
Dimension in inches and (millimeters)
DO-214AA (SMB J-Bend)
Dimensions
Inches
Millimeters
Min
Max
Min
Max
A
0.077
0.086
1.950
2.200
B
0.160
0.180
4.060
4.570
C
0.130
0.155
3.300
3.940
D
0.084
0.096
2.130
2.440
E
0.030
0.060
0.760
1.520
F
-
0.008
-
0.203
G
0.205
0.220
5.210
5.590
H
0.006
0.012
0.152
0.305
Environmental Specifications
High Temp. Storage
JESD22-A103
HTRB
JESD22-A108
Temperature Cycling
JESD22-A104
MSL
JEDEC-J-STD-020, Level 1
H3TRB
JESD22-A101
RSH
JESD22-B106