Littelfuse SM Series - Manual (Page 5)

TVS Diode Arrays
(SPA ® Diodes)
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/05/13
9
SM S
eries
General Purpose ESD Protection - SM05 through SM36
Time
Te
mperatur
e
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
Preheat Preheat
Ramp-up Ramp-up
Ramp-down Ramp-do
Critical Zone
T L to T P
Critical Zone
T L to T P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (min to max) (t
s
) 60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
L
) to peak
3°C/second max
T
S(max)
to T
L
- Ramp-up Rate 3°C/second max
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 260 +0/-5 °C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
P
) 8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Product Characteristics
Lead Plating Matte Tin
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Ordering Information
Part Number Package Marking Min. Order Qty.
SM05-02HTG SOT23-3 M05 3000
SM12-02HTG SOT23-3 M12 3000
SM15-02HTG SOT23-3 M15 3000
SM24-02HTG SOT23-3 M24 3000
SM36-02HTG SOT23-3 M36 3000
0
2
4
6
8
10
12
14
16
18
20
0 5 10 15 20 25 30 35 40
SM24
TLP Voltage (V)
TL
P
Cu
rr
en
t (A
)
SM24 Transmission Line Pulsing(TLP) Plot
0
2
4
6
8
10
12
14
16
18
20
0 5 10 15 20 25 30 35 40 45 50 55
SM36
TLP Voltage (V)
TL
P
Cu
rr
en
t (A
)
SM36 Transmission Line Pulsing(TLP) Plot