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Tvs diode arrays, General purpose esd protection - sm05 through sm36, Diodes) – Littelfuse SM Series User Manual

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TVS Diode Arrays

(SPA

®

Diodes)

© 2013 Littelfuse, Inc.

Specifications are subject to change without notice.

Revised: 12/05/13

6

General Purpose ESD Protection - SM05 through SM36

Notes:
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

Absolute Maximum Ratings

Symbol

Parameter

Value

Units

P

Pk

Peak Pulse Power (t

p

=8/20μs)

400

W

T

OP

Operating Temperature

-40 to 125

°C

T

STOR

Storage Temperature

-55 to 150

°C

SM05 Electrical Characteristics

(T

OP

=25ºC)

Parameter

Symbol

Test Conditions

Min

Typ

Max

Units

Reverse Standoff Voltage

V

RWM

I

R

≤1μA

5.0

V

Reverse Voltage Drop

V

R

I

R

=1mA

6.0

V

Leakage Current

I

LEAK

V

R

=5V

1.0

μA

Clamp Voltage

1

V

C

I

PP

=1A, t

p

=8/20µs, Pin 1 or Pin 2 to Pin 3

9.8

V

I

PP

=10A, t

p

=8/20µs, Pin 1 or Pin 2 to Pin 3

13.0

V

Dynamic Resistance

2

R

DYN

TLP, t

p

=100ns, I/O to GND

0.19

Peak Pulse Current

(8/20µs)

1

Ipp

t

p

=8/20µs

24.0

A

ESD Withstand Voltage

1

V

ESD

IEC61000-4-2 (Contact Discharge)

±30

kV

IEC61000-4-2 (Air Discharge)

±30

kV

Diode Capacitance

1

C

I/O-GND

Reverse Bias=0V, f=1MHz

400

pF

C

I/O-I/O

Reverse Bias=0V, f=1MHz

350

pF

Thermal Information

Parameter

Rating

Units

Storage Temperature Range

-55 to 150

°C

Maximum Junction Temperature

150

°C

Maximum Lead Temperature (Soldering 20-40s)

260

°C

SM12 Electrical Characteristics

(T

OP

=25ºC)

Parameter

Symbol

Test Conditions

Min

Typ

Max

Units

Reverse Standoff Voltage

V

RWM

I

R

≤1μA

12.0

V

Reverse Voltage Drop

V

R

I

R

=1mA

13.3

V

Leakage Current

I

LEAK

V

R

=12V

1.0

μA

Clamp Voltage

1

V

C

I

PP

=1A, t

p

=8/20µs, Pin 1 or Pin 2 to Pin 3

18.5

V

I

PP

=10A, t

p

=8/20µs, Pin 1 or Pin 2 to Pin 3

22.5

V

Dynamic Resistance

2

R

DYN

TLP, t

p

=100ns, I/O to GND

0.25

Peak Pulse Current

(8/20µs)

1

Ipp

t

p

=8/20µs

17.0

A

ESD Withstand Voltage

1

V

ESD

IEC61000-4-2 (Contact Discharge)

±30

kV

IEC61000-4-2 (Air Discharge)

±30

kV

Diode Capacitance

1

C

I/O-GND

Reverse Bias=0V, f=1MHz

150

pF

C

I/O-I/O

Reverse Bias=0V, f=1MHz

120

pF