Littelfuse SP050xBA Lead-Free_Green Series - Manual (Page 3)

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
TVS Diode Arrays
(SPA ® Diodes)
General Purpose ESD Protection - SP05 Series
Time
Te
mperatur
e
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
Preheat Preheat
Ramp-up Ramp-up
Ramp-down Ramp-do
Critical Zone
T L to T P
Critical Zone
T L to T P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (min to max) (t
s
) 60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
L
) to peak
5°C/second max
T
S(max)
to T
L
- Ramp-up Rate 5°C/second max
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 260 +0/-5 °C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate 5°C/second max
Time 25°C to peak Temperature (T
P
) 8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Package Dimensions — SOT143
503B
E E1
c
e
e1
1 2
4 3
b2 b A1
A
D
L
L1
3.40 (.134")
3.60 (.140")
0.80 (.032")
1.00 (.040")
2.20
(.087")
REF
1.90
(.075")
1.70
(.067")
1.00 (.040")
1.20 (.048") 0.80 (.032")
1.00 (.040")
BSC
MAX
1.40 (.055")
SP0503BAHTG - SOT143-4
Package SOT143-4
Pins 4
JEDEC TO-253
Millimeters Inches
Min Max Min Max
A 0.8 1.22 0.03 0.048
A1 0.05 0.15 0.002 0.006
b 0.30 0.50 0.012 0.020
b2 0.76 0.89 0.030 0.035
c 0.08 0.20 0.003 0.008
D 2.80 3.04 0.110 0.120
E 2.10 2.64 0.082 0.104
E1 1.20 1.40 0.047 0.055
e 1.92 BSC 0.076 BSC
e1 0.20 BSC 0.008 BSC
L 0.4 0.6 0.016 0.024
L1 0.550 REF 0.022 REF
503B
E E1
c
e
e1
1 2
4 3
b2 b A1
A
D
L
L1
3.40 (.134")
3.60 (.140")
0.80 (.032")
1.00 (.040")
2.20
(.087")
REF
1.90
(.075")
1.70
(.067")
1.00 (.040")
1.20 (.048") 0.80 (.032")
1.00 (.040")
BSC
MAX
1.40 (.055")
Recommended Pad Layout