Littelfuse SP1007 Series - Manual (Page 5)

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/22/13
TVS Diode Arrays
(SPA ® Diodes)
General Purpose ESD Protection - SP1007 Series
Embossed Carrier Tape & Reel Specification — SOD882
Symbol Millimeters
A0 0.70±0.045
B0 1.10±0.045
K0 0.65±0.045
F 3.50±0.05
P1 2.00±0.10
W 8.00 + 0.30 -0.10
Embossed Carrier Tape & Reel Specification — 0201 Flipchip
0.28
0.30
0.75 0.19
Recommended Solder Pad Footprint A0 K0 B0
T
P0 P1
P2
D
D1
E
F
W
*Sizes in mm
Symbol Millimeters
A0 0.41±0.03
B0 0.70±0.03
D ø 1.50 + 0.10
D1 ø 0.20 ± 0.05
E 1.75±0.10
F 3.50±0.05
K0 0.38±0.03
P0 2.00±0.05
P1 2.00±0.05
P2 4.00±0.10
W 8.00 + 0.30 -0.10
T 0.23±0.02