Littelfuse SMCJ-HRA Series - Manual (Page 5)

Transient Voltage Suppression Diodes
38
TVS Diode Arrays
(SPA ™ Family of Products)
©2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/24/13
Surface Mount – 1500W > SMCJ-HRA series
SMCJ-HRA Series
Physical Specifications
Weight 0.007 ounce, 0.21 grams
Case
JEDEC DO214AB. Molded plastic body
over glass passivated junction
Polarity
Color band denotes positive end
(cathode) except Bidirectional.
Terminal
Matte Tin-plated leads, Solderable per
JESD22-B102D
Dimensions
Soldering Parameters
Te
mperature (T
)
Time (t)
T
s(min)
T
s(max)
T
L
T
P
t
s
Preheat
t
L
t
p
Ramp-up Critical Zone
T
L to T P
Ramp-down
t 25˚C to Peak
25˚C
Reflow Condition Lead–free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (min to max) (t
s
) 60 – 180 secs
Average ramp up rate (Liquidus Temp
(T
L
) to peak
3°C/second max
T
S(max)
to T
L
- Ramp-up Rate 3°C/second max
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Time (min to max) (t
s
) 60 – 150 seconds
Peak Temperature (T
P
) 260 +0/-5 °C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
P
) 8 minutes Max.
Do not exceed 280°C
Dimensions
Inches Millimeters
Min Max Min Max
A 0.114 0.126 2.900 3.200
B 0.260 0.280 6.600 7.110
C 0.220 0.245 5.590 6.220
D 0.079 0.103 2.060 2.620
E 0.030 0.060 0.760 1.520
F 0.002 0.008 0.051 0.203
G 0.305 0.320 7.750 8.130
H 0.006 0.012 0.152 0.305
I 0.129 - 3.300 -
J 0.094 - 2.400 -
K - 0.165 - 4.200
L 0.094 - 2.400 -
DO-214AB (SMC J-Bend)
B
F
G
H
E
C
D
A
Cathode Band
(for Uni-directional products only)
(all dimensions in mm)
I
L K J
Solder Pads
5
Environmental Specifications
High Temp. Storage JESD22-A103
HTRB JESD22-A108
Thermal Shock JESD22-A106
MSL JEDEC-J-STD-020C, Level 1
H3TRB JESD22-A101
RSH JESD22-B106C