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Varistor products – Littelfuse MHS Varistor Series User Manual

Page 4

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© 2013 Littelfuse, Inc.

26

Revised: December 16, 2013

Varistor Products

MHS Varistor Series

Surface Mount Multilayer Varistors (MLVs) > MHS Series

Specifications are subject to change without notice.

Please refer to www.littelfuse.com/series/MHS.html for current information.

Product Dimensions (mm)

DIMENSION

A

mm

1.70

0.020

0402

2.54

0.030

TABLE 1: PAD LAYOUT DIMENSIONS

0603

in

0.067

0.100

B

mm

0.510

0.760

in

0.610

0.890

C

mm

0.024

0.035

in

Note: Avoid metal runs in this area, parts are not
recommended for use in applications using silver
(Ag) expoxy paste.

Note: Avoid metal runs in this area, parts are
not recommended for use in applications using
Silver (Ag) epoxy paste.

D

E

W

L

Dimension

0402 Size

0603 Size

IN

MM

IN

MM

A

0.067

1.700

0.100

2.540

B

0.020

0.510

0.030

0.760

C

0.024

0.610

0.035

0.890

D (max.)

0.024

0.600

0.040

1.000

E

0.01 +/- 0.006

0.25 +/- 0.15

0.015 +/- 0.008

0.4 +/- 0.2

L

0.039 +/- 0.004

1.00 +/- 0.10

0.063 +/- 0.006

1.6 +/- 0.15

W

0.020 +/- 0.004

0.50 +/- 0.10

0.032 +/- 0.006

0.8 +/- 0.15

PAD LAyOUT DEMENSIONS

CHIP LAyOUT DIMENSIONS

6.

5.

230

5.0 6.0 7.0

MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C

PREHEAT ZONE

RAMP RATE
<3˚C/s

60 - 150 SEC

> 217˚C

FIGURE 7. LEAD-FREE RE-FLOW PROFILE

Lead–free (Pb-free) Soldering Recommendations

Littelfuse offers the Nickel Barrier Termination finish for the
optimum Lead–free solder performance.

The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA
flux, but there is a wide selection of pastes and fluxes
available with which the Nickel Barrier parts should be
compatible.

The reflow profile must be constrained by the maximums
in the Lead–free Reflow Profile. For Lead–free wave
soldering, the Wave Solder Profile still applies.

Note: the Lead–free paste, flux and profile were used for
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.

Lead–free Re-flow Profile

Figure 10