Varistor products – Littelfuse MHS Varistor Series User Manual
Page 4
© 2013 Littelfuse, Inc.
26
Revised: December 16, 2013
Varistor Products
MHS Varistor Series
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MHS.html for current information.
Product Dimensions (mm)
DIMENSION
A
mm
1.70
0.020
0402
2.54
0.030
TABLE 1: PAD LAYOUT DIMENSIONS
0603
in
0.067
0.100
B
mm
0.510
0.760
in
0.610
0.890
C
mm
0.024
0.035
in
Note: Avoid metal runs in this area, parts are not
recommended for use in applications using silver
(Ag) expoxy paste.
Note: Avoid metal runs in this area, parts are
not recommended for use in applications using
Silver (Ag) epoxy paste.
D
E
W
L
Dimension
0402 Size
0603 Size
IN
MM
IN
MM
A
0.067
1.700
0.100
2.540
B
0.020
0.510
0.030
0.760
C
0.024
0.610
0.035
0.890
D (max.)
0.024
0.600
0.040
1.000
E
0.01 +/- 0.006
0.25 +/- 0.15
0.015 +/- 0.008
0.4 +/- 0.2
L
0.039 +/- 0.004
1.00 +/- 0.10
0.063 +/- 0.006
1.6 +/- 0.15
W
0.020 +/- 0.004
0.50 +/- 0.10
0.032 +/- 0.006
0.8 +/- 0.15
PAD LAyOUT DEMENSIONS
CHIP LAyOUT DIMENSIONS
6.
5.
230
5.0 6.0 7.0
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
PREHEAT ZONE
RAMP RATE
<3˚C/s
60 - 150 SEC
> 217˚C
FIGURE 7. LEAD-FREE RE-FLOW PROFILE
Lead–free (Pb-free) Soldering Recommendations
Littelfuse offers the Nickel Barrier Termination finish for the
optimum Lead–free solder performance.
The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA
flux, but there is a wide selection of pastes and fluxes
available with which the Nickel Barrier parts should be
compatible.
The reflow profile must be constrained by the maximums
in the Lead–free Reflow Profile. For Lead–free wave
soldering, the Wave Solder Profile still applies.
Note: the Lead–free paste, flux and profile were used for
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.
Lead–free Re-flow Profile
Figure 10