Littelfuse SP1011 Series - Manual (Page 3)

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/10/13
TVS Diode Arrays
(SPA ® Diodes)
General Purpose ESD Protection - SP1011 Series
Package Dimensions — µDFN-6 (1.25x1.0x0.5mm)
Package µDFN-6 (1.25x1.0x0.5mm)
JEDEC MO-229
Symbol
Millimeters Inches
Min Max Min Max
A 0.45 0.55 0.018 0.022
A1 0.00 0.05 0.000 0.002
A3 0.127 REF 0.005 REF
b 0.15 0.25 0.006 0.010
D 1.20 1.30 0.047 0.051
D2 - - - -
E 0.95 1.05 0.037 0.041
E2 - - - -
e 0.4 REF 0.016 REF
L 0.25 0.35 0.010 0.014
D
E
B
1 2 3
6 5 4
Top View
Pin 1 Index Area
A
A
1 2 3
5 4 6
L
Pin 1 chamfer
0.10 x 45’
℮
0.05 C
Bottom View
0.05 C
0.05 C
b
A1
A3
C
Seating plane
Side View
0.10 C A M B
0.05 C M
Recommanded Soldering Pad for µDFN-6L 1.25 x1.0x0.5 mm
1.1
0.4
0.1 0.3
0.3
0.4
1.
1
Total:+/- 0.01mm
Time
Te
mperatur
e
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
Preheat Preheat
Ramp-up Ramp-up
Ramp-down Ramp-do
Critical Zone
T L to T P
Critical Zone
T L to T P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (min to max) (t
s
) 60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
L
) to peak
3°C/second max
T
S(max)
to T
L
- Ramp-up Rate 3°C/second max
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 260 +0/-5 °C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
P
) 8 minutes Max.
Do not exceed 260°C
Soldering Parameters