Littelfuse SP1006 Series - Manual (Page 3)

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
TVS Diode Arrays
(SPA ® Diodes)
General Purpose ESD Protection - SP1006 Series
TVS Diode Arrays
(SPA ® Diodes)
General Purpose ESD Protection – SP1006 Series
Clamping Voltage vs. I
PP
Peak Pulse Current-I
PP
(A)
Clamp Voltage (V
C
)
0.0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
16.0
1.0 1.5 2.0 2.5 3.0 3.5 4.0
Time
Te
mperatur
e
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
Preheat Preheat
Ramp-up Ramp-up
Ramp-down Ramp-do
Critical Zone
T L to T P
Critical Zone
T L to T P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (min to max) (t
s
) 60 – 180 secs
Average ramp up rate (Liquidus) Temp (T
L
)
to peak
3°C/second max
T
S(max)
to T
L
- Ramp-up Rate 3°C/second max
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 260 +0/-5 °C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
P
) 8 minutes Max.
Soldering Parameters
Package Dimensions — μDFN-2 (0201)
Package μDFN-2 (0201)
JEDEC MO-236
Symbol
Millimeters Inches
Min Max Min Max
A 0.34 0.40 0.014 0.016
A1 0.00 0.05 0.000 0.002
A2 0.075 REF 0.003 REF
b 0.20 REF 0.008 REF
D 0.55 0.65 0.022 0.026
E 0.25 0.35 0.010 0.014
L 0.175 0.275 0.007 0.011
K1 0.15 REF 0.006 REF
D
E
L
2
b
K1
BOTTOM VIEW TOP VIEW
SIDE VIEW
0.10
0.05
C A B
C
A
C 0.10
A1 A2
0.08 C
SEATING
PLANE
1
2X
2X
0.10
0.10
C
C
General Purpose ESD Protection – SP1006 Series