5 solder paste, 6 ge863 solder reflow – Rainbow Electronics GE863-PY User Manual
Page 73
GE863 Hardware User Guide
1vv0300783 Rev.0 - 10/06/08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 73 of 80
Recommendations for PCB pad surfaces:
Finish
Layer thickness [µm]
Properties
Electro-less Ni /
Immersion Au
3 –7 /
0.05 – 0.15
Good solder ability protection, high
shear force values
The PCB must be able to resist the higher temperatures, which are occurring at the lead-free process.
This issue should be discussed with the PCB-supplier. Generally, the wet-ability of tin-lead solder
paste on the described surface plating is better compared to lead-free solder paste.
12.1.5 Solder paste
Lead free
Solder paste
Sn/Ag/Cu
12.1.6 GE863 Solder Reflow
The following is the recommended solder reflow profile
- BT-R900 (2 pages)
- BT-R800 (2 pages)
- UC864 (36 pages)
- BT-R920 (2 pages)
- GM862-GPS (120 pages)
- GM862-GPS (100 pages)
- GM862-GPS (73 pages)
- GM862-QUAD-PY (63 pages)
- GM862-QUAD-PY (434 pages)
- GM862-QUAD-PY (68 pages)
- GM862-QUAD-PY (96 pages)
- WE865-DUAL (22 pages)
- CF-R900 (2 pages)
- BT-R820 (2 pages)
- GT863-PY (50 pages)
- ATR0610 (13 pages)
- GT864-PY (23 pages)
- FARGO MAESTRO 100 (with TCP_IP) (16 pages)
- FARGO MAESTRO 100 (with TCP_IP) (787 pages)
- ATR0622 (26 pages)
- EB-A803 (9 pages)
- GE863-GPS low power (122 pages)
- EB-A801 (18 pages)
- GE863-PRO3 (55 pages)
- L10 (2 pages)
- GM-R800 (2 pages)
- ATR0600 (11 pages)
- GM-R305 (3 pages)
- GM-R900 (2 pages)
- ATR0630 (35 pages)
- DL-200BT-D (3 pages)
- DL-200 (3 pages)
- ATR0601 (17 pages)
- ATR0620 (15 pages)
- ATR0625 (26 pages)
- MG260 (87 pages)
- MG260 (246 pages)
- DL-100 (3 pages)
- GM-R500 (2 pages)
- EB-A802 (9 pages)
- ATR0621 (20 pages)
- EB-230 (10 pages)
- GM-R306-AA (2 pages)
- 900 (239 pages)