1 general, 1 module finishing & dimensions – Rainbow Electronics GE863-PY User Manual
Page 67
GE863 Hardware User Guide
1vv0300783 Rev.0 - 10/06/08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 67 of 80
12 Mounting the GE863 on the Application
Board
12.1 General
The
Telit GE863 modules
have been designed in order to be compliant with a standard lead-free SMT
process
12.1.1 Module Finishing & Dimensions
Surface finishing Ni/Au for all test pads
Lead-free Alloy:
Surface finishing Sn/Ag/Cu for all solder pads
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