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2 debug of the ge863 in production, 3 stencil – Rainbow Electronics GE863-PY User Manual

Page 70

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GE863 Hardware User Guide

1vv0300783 Rev.0 - 10/06/08

Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved

page 70 of 80

12.1.2 Debug of the GE863 in Production

To test and debug the mounting of the GE863, we strongly recommend to foreseen test pads on the
host PCB, in order to check the connection between the GE863 itself and the application and to test
the performance of the module connecting it with an external computer. Depending by the customer
application, these pads include, but are not limited to the following signals:

• TXD

• RXD
• ON/OFF

• RESET

• GND

• VBATT

• TX_TRACE

• RX_TRACE

PWRMON

12.1.3 Stencil

Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a
thickness of stencil foil ≥ 120µm.