Rainbow Electronics MAX19995А - Manual (Page 18)

MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
18 ______________________________________________________________________________________
Pin Description
PIN NAME FUNCTION
1 RFMAIN Main Channel RF input. Internally matched to 50 Ω. Requires an input DC-blocking capacitor.
2 TAPMAIN
Main Channel Balun Center Tap. Bypass to GND with 39pF and 0.033µF capacitors as close as
possible to the pin with the smaller value capacitor closer to the part.
3, 5, 7, 12,
20, 22, 24,
25, 26, 34
GND Ground
4, 6, 10, 16,
21, 30, 36
V CC
Power Supply. Bypass to GND with capacitors as shown in the Typical Application Circuit as close as
possible to the pin.
8 TAPDIV
Diversity Channel Balun Center Tap. Bypass to GND with 39pF and 0.033µF capacitors as close as
possible to the pin with the smaller value capacitor closer to the part.
9 RFDIV Diversity Channel RF input. Internally matched to 50 Ω. Requires an input DC-blocking capacitor.
11 IFD_SET
IF Diversity Amplifier Bias Control. Connect a resistor from this pin to ground to set the bias current for
the diversity IF amplifier (see the Typical Operating Characteristics for typical performance vs.
resistor value).
13, 14 IFD+, IFD-
Diversity Mixer Differential IF Output. Connect pullup inductors from each of these pins to V CC (see
the Typical Application Circuit).
15 IND_EXTD
Diversity External Inductor Connection. Connect this pin to ground. For improved RF-to-IF and LO-to-
IF isolation, connect a low-ESR 10nH inductor from this pin to ground (see the Typical Operating
Characteristics for typical performance vs. inductor value).
17 LO_ADJ_D
LO Diversity Amplifier Bias Control. Connect a resistor from this pin to ground to set the bias current
for the diversity LO amplifier (see the Typical Operating Characteristics for typical performance vs.
resistor value).
18, 28 N.C. No Connection. Not internally connected.
19 LO1 Local Osci l l ator 1 Inp ut. Thi s i np ut i s i nter nal l y m atched to 50 Ω . Req ui r es an i np ut D C - b l ocki ng cap aci tor .
23 LOSEL Local Oscillator Select. Set this pin to high to select LO1. Set to low to select LO2.
27 LO2 Local Osci l l ator 2 Inp ut. Thi s i np ut i s i nter nal l y m atched to 50 Ω . Req ui r es an i np ut D C - b l ocki ng cap aci tor .
29 LO_ADJ_M
LO M ai n Am p l i fi er Bi as C ontr ol . C onnect a r esi stor fr om thi s p i n to g r ound to set the b i as cur r ent for the
m ai n LO am p l i fi er ( see the Typical Operating Characteristics for typ i cal p er for m ance vs. r esi stor val ue) .
31 IND_EXTM
Main External Inductor Connection. Connect this pin to ground. For improved RF-to-IF and LO-to-IF
isolation, connect a low-ESR 10nH inductor from this pin to ground (see the Typical Operating
Characteristics for typical performance vs. inductor value).
32, 33 IFM-, IFM+
Main Mixer Differential IF Output. Connect pullup inductors from each of these pins to V
CC
(see the
Typical Application Circuit).
35 IFM_SET
IF M ai n Am p l i fi er Bi as C ontr ol . C onnect a r esi stor fr om thi s p i n to g r ound to set the b i as cur r ent for the
m ai n IF am p l i fi er ( see the Typical Operating Characteristics for typ i cal p er for m ance vs. r esi stor val ue) .
— EP
Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple
ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple
ground vias are also required to achieve the noted RF performance.