Rainbow Electronics Т7024 - Manual (Page 17)

17
T7024
4533A–BLURF–09/02
Figure 31. Layout for N20
Gerberfiles are available on request.
The application board consists of 4 layers:
1. top layer: RF-signals, 35 µm Cu
2. spacing: 490 µm FR4
3. second layer: GND, 35 µm Cu
4. spacing: 550 µm FR4
5. third layer: GND (optional), 35 µm Cu
6. spacing: 490 µm FR4
7. bottom layer: DC connection, 35 µm Cu
0R
1pF
0R
0R
2.2pF
100pF
100pF
LED
0R
390R
2k7
0R
1.8pF
0R
56p
2.2pF
HQ
1nF
1nF 15pF
1nF 10pF
56pF
3.3pF
0R
0R
HQ
18nH HQ
0.8pF HQ
LNA_OUT PA_IN
LNA_IN PA_OUT
15pF
1 mF
1 mF
1 mF
1 mF