Intel WiFi Link 5100 - Manual (Page 3)

Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
July 2008 TDG
Order Number: 318676-003US 3
Intel ® 5100 MCH Chipset
Contents
1.0 Introduction ..............................................................................................................6
1.1
Design Flow........................................................................................................6
1.2 Definition of Terms ..............................................................................................7
1.3 Related Documents .............................................................................................8
1.4 Thermal Simulation .............................................................................................9
2.0 Packaging Technology ...............................................................................................9
2.1
Package Mechanical Requirements....................................................................... 11
3.0 Thermal Specifications ............................................................................................ 12
3.1
Thermal Design Power (TDP) .............................................................................. 12
3.2 Case Temperature ............................................................................................. 12
4.0 Thermal Solution Requirements............................................................................... 12
4.1
Characterizing the Thermal Solution Requirement .................................................. 12
5.0 Thermal Metrology .................................................................................................. 15
5.1
MCH Case Measurement..................................................................................... 15
5.1.1
Supporting Test Equipment...................................................................... 15
5.1.2 Thermal Calibration and Controls.............................................................. 16
5.1.3 IHS Groove ........................................................................................... 16
5.1.4 Thermocouple Conditioning and Preparation............................................... 18
5.1.5 Thermocouple Attachment to IHS ............................................................. 18
5.1.6 Curing Process ....................................................................................... 22
5.1.7 Thermocouple Wire Management.............................................................. 23
5.2 Power Simulation Software ................................................................................. 24
6.0 Reference Thermal Solution..................................................................................... 24
6.1
AdvancedTCA* Reference Heatsink ...................................................................... 25
6.1.1
Thermal Performance.............................................................................. 25
6.1.2 Mechanical Design Envelope .................................................................... 25
6.1.3 Board-level Components Keepout Dimensions ............................................ 26
6.1.4 Torsional Clip Heatsink Thermal Solution Assembly ..................................... 26
6.1.5 Heatsink Orientation ............................................................................... 27
6.1.6 Extruded Heatsink Profiles ....................................................................... 27
6.1.7 Mechanical Interface Material................................................................... 27
6.1.8 Thermal Interface Material....................................................................... 27
6.1.8.1
Effect of Pressure on TIM Performance......................................... 28
6.1.9 Heatsink Clip ......................................................................................... 28
6.1.10 Clip Retention Anchors ............................................................................ 28
6.1.11 Reliability Guidelines............................................................................... 28
6.2 CompactPCI* Reference Heatsink ........................................................................ 29
6.2.1 Component Overview.............................................................................. 29
6.2.2 Thermal Solution Performance Characteristics ............................................ 30
7.0 Reliability Guidelines ............................................................................................... 30
A Mechanical Drawings............................................................................................... 31
B Thermal Solution Component Suppliers ................................................................... 40