Figure 4. mch package dimensions (bottom view), 1 package mechanical requirements, Package mechanical requirements – Intel WiFi Link 5100 User Manual
Page 11: Mch package dimensions (bottom view), Figure 4, The intel
Intel
®
5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
July 2008
TDG
Order Number: 318676-003US
11
Intel
®
5100 MCH Chipset
2.1
Package Mechanical Requirements
The Intel
®
5100 MCH Chipset package has an integrated heat spreader (IHS) that is
capable of sustaining a maximum static normal load of 15 lbf. These mechanical load
limits must not be exceeded during heatsink installation, mechanical stress testing,
standard shipping conditions and/or any other use condition.
Note:
The heatsink attach solutions must not include continuous stress to the chipset
package with the exception of a uniform load to maintain the heatsink-to-package
thermal interface.
Figure 4.
MCH Package Dimensions (Bottom View)
Notes:
1.
All dimensions are in millimeters.
2.
All dimensions and tolerances conform to ANSI Y14.5M-1994.
42.5 + 0.05
11
25
23
21
19
17
15
13
9
7
5
3
1
27
29
37
33
35
31
28
22
26
24
20
18
16
14
12
10
8
6
4
2
36
34
32
30
38
A
AJ
AE
AC
AA
U
R
N
L
J
G
E
C
W
AG
AL
AN
AR
AU
AH
AF
AD
AB
Y
V
T
P
M
K
H
F
D
AK
AM
AP
AT
AV
B
A
B
42.5 + 0.05
C
A
0.2
- A -
37X 1.092
20.202
20.202
37X 1.092