Table 7. reliability guidelines, 2 compactpci* reference heatsink, 1 component overview – Intel WiFi Link 5100 User Manual
Page 29: Compactpci* reference heatsink, Component overview, Reliability guidelines, Table 7
Intel
®
5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
July 2008
TDG
Order Number: 318676-003US
29
Intel
®
5100 MCH Chipset
6.2
CompactPCI* Reference Heatsink
Intel has also developed a reference thermal solution compatible with the CompactPCI*
form factor. The reference solution was developed assuming a maximum ambient
temperature of 67 °C with a minimum volumetric airflow rate of 10 CFM through each
slot. Assuming these boundary conditions are met, the reference thermal solution
meets the thermal specifications for Intel
®
5100 Memory Controller Hub Chipset.
6.2.1
Component Overview
The CompactPCI* reference heatsink is an extruded aluminum heatsink and does not
share the same volumetric footprint as the AdvancedTCA* reference heatsink. Full
mechanical drawings of the thermal solution assembly, full mechanical drawings,
volumetric footprint, and the heatsink clip are provided in
. It uses the same
spring clip retention and Honeywell* PCM45F Thermal Interface Material (TIM) as the
AdvancedTCA* reference solution.
shows the isometric view of the CompactPCI* reference heatsink.
Table 7.
Reliability Guidelines
Test
1
Requirement
Pass/Fail Criteria
2
Mechanical Shock
50 g, board level, 11 ms, three shocks/axis
Visual Check and Electrical Functional Test
Random Vibration
7.3 g, board level, 45 minutes/axis, 50 Hz to 2000 Hz
Visual Check and Electrical Functional Test
Temperature Life
85 °C, 2000 hours total, checkpoints at 168, 500, 1000,
and 2000 hours
Visual Check
Thermal Cycling
-5 °C to +70 °C, 500 cycles
Visual Check
Humidity
85% relative humidity, 55 °C, 1000 hours
Visual Check
Notes:
1.
It is recommended that the above tests be performed on a sample size of at least 12 assemblies from three lots of
material.
2.
Additional pass/fail criteria may be added at the discretion of the user.
Figure 21.
Isometric View of the CompactPCI* Reference Heatsink
Note:
for more detailed mechanical drawings of the heatsink.