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Table 7. reliability guidelines, 2 compactpci* reference heatsink, 1 component overview – Intel WiFi Link 5100 User Manual

Page 29: Compactpci* reference heatsink, Component overview, Reliability guidelines, Table 7

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Intel

®

5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008

TDG

Order Number: 318676-003US

29

Intel

®

5100 MCH Chipset

6.2

CompactPCI* Reference Heatsink

Intel has also developed a reference thermal solution compatible with the CompactPCI*

form factor. The reference solution was developed assuming a maximum ambient

temperature of 67 °C with a minimum volumetric airflow rate of 10 CFM through each

slot. Assuming these boundary conditions are met, the reference thermal solution

meets the thermal specifications for Intel

®

5100 Memory Controller Hub Chipset.

6.2.1

Component Overview

The CompactPCI* reference heatsink is an extruded aluminum heatsink and does not

share the same volumetric footprint as the AdvancedTCA* reference heatsink. Full

mechanical drawings of the thermal solution assembly, full mechanical drawings,

volumetric footprint, and the heatsink clip are provided in

Appendix A

. It uses the same

spring clip retention and Honeywell* PCM45F Thermal Interface Material (TIM) as the

AdvancedTCA* reference solution.

Figure 21

shows the isometric view of the CompactPCI* reference heatsink.

Table 7.

Reliability Guidelines

Test

1

Requirement

Pass/Fail Criteria

2

Mechanical Shock

50 g, board level, 11 ms, three shocks/axis

Visual Check and Electrical Functional Test

Random Vibration

7.3 g, board level, 45 minutes/axis, 50 Hz to 2000 Hz

Visual Check and Electrical Functional Test

Temperature Life

85 °C, 2000 hours total, checkpoints at 168, 500, 1000,

and 2000 hours

Visual Check

Thermal Cycling

-5 °C to +70 °C, 500 cycles

Visual Check

Humidity

85% relative humidity, 55 °C, 1000 hours

Visual Check

Notes:

1.

It is recommended that the above tests be performed on a sample size of at least 12 assemblies from three lots of

material.

2.

Additional pass/fail criteria may be added at the discretion of the user.

Figure 21.

Isometric View of the CompactPCI* Reference Heatsink

Note:

Refer to

Appendix A

for more detailed mechanical drawings of the heatsink.