HP XW6200 - Manual (Page 46)

HP SpaceMouse Plus USB HP SpaceMouse Plus USB HP SpaceMouse Plus USB HP SpaceMouse Plus USB Physical characteristics Physical characteristics Physical characteristics Physical characteristics Dimensions Dimensions Dimensions Dimensions (H x W x D) 7.4 x 4.72 x 1.73 in (18.8 x 12.0 x 4.4 cm)
Cap Diameter Cap Diameter Cap Diameter Cap Diameter 2 x 6.5 x 6.6 mm
Weight Weight Weight Weight 1.5 lb (0.68 kg)
Features Features Features Features Six degrees of freedom motion control through
the X, Y, Z axis (pitch, roll, yaw)
Certified for leading CAD and DCC applications
Environmental Environmental Environmental Environmental Operating temperature Operating temperature Operating temperature Operating temperature 41° to 140° F (5° to 60° C)
Non-operating Non-operating Non-operating Non-operating
temperature
temperature temperature temperature
-13° to 158° F (-25° to 70° C)
Operating humidity Operating humidity Operating humidity Operating humidity 10 to 98 % RH (non-condensing)
Non-operating humidity Non-operating humidity Non-operating humidity Non-operating humidity 10 to 98 % RH (non-condensing)
Mechanical Mechanical Mechanical Mechanical Buttons Buttons Buttons Buttons 11 programmable (unshifted)
Cap Force Range Cap Force Range Cap Force Range Cap Force Range 0.2 N – 4.5 N
Cap Torque Range Cap Torque Range Cap Torque Range Cap Torque Range 4 Nmm to 100 Nmm
Resolution Resolution Resolution Resolution 8 bit
USB Specifications USB Specifications USB Specifications USB Specifications Connector Connector Connector Connector USB 1.1 or greater
Cable Length Cable Length Cable Length Cable Length 2 m
Data Rate Data Rate Data Rate Data Rate 16 msec
Software Drivers Available Software Drivers Available Software Drivers Available Software Drivers Available Microsoft Windows XP
System Requirements System Requirements System Requirements System Requirements Disk Space Disk Space Disk Space Disk Space 10 MB free disk space
Regulatory Approvals Regulatory Approvals Regulatory Approvals Regulatory Approvals UL, cUL, EN 950, EN 60950, CSA, FCC, CE Mark, TUV, CISPR 22, EN
50082, IEC 1000 4-2, IEC 1000-4-3, AS/NZS, VCCI, BSMI, C-Tick
1394 Firewire FH/LP 1394 Firewire FH/LP 1394 Firewire FH/LP 1394 Firewire FH/LP
Card
Card Card Card (PCI)
Device Interface Protocol Device Interface Protocol Device Interface Protocol Device Interface Protocol IEEE-1394a
Data Rate
Data Rate Data Rate Data Rate 100Mbits/s, 200Mbit/s and 400Mbits/s
Devices Supported Devices Supported Devices Supported Devices Supported IEEE-1394 compliant devices
Connectors Connectors Connectors Connectors Two IEEE1394 6-Pin Connector (Bracket Side)
One 10-Pin (9 Contacts) Custom Connector (Internal)
Bus Interface Bus Interface Bus Interface Bus Interface PCI
Physical Physical Physical Physical Low profile PCI card with a full height bracket
Environmental Environmental Environmental Environmental Operating temperature Operating temperature Operating temperature Operating temperature 32° to 104° F (0° to 50° C)
Non-operating Non-operating Non-operating Non-operating
temperature
temperature temperature temperature
-13° to 158° F (-25° to 70° C)
Relative humidity Relative humidity Relative humidity Relative humidity 5% to 95%
Ports Ports Ports Ports 3 cable ports
Minimum System Minimum System Minimum System Minimum System
Requirements
Requirements Requirements Requirements
Microsoft XP Professional or Red Hat Linux 7.3/9.0 (Class Driver)
Pentium II 266 or faster
64-MB RAM
Available PCI slot
CD-ROM drive
Regulatory Agency Regulatory Agency Regulatory Agency Regulatory Agency
Approval
Approval Approval Approval
FCC Part 15B, cULus 60950, CE Mark EN55022B(1995)/EN55024-1998
STD, Taiwan BSMI CNS13438, Korea MIC
QuickSpecs
HP xw6200 Workstation HP xw6200 Workstation HP xw6200 Workstation HP xw6200 Workstation
Technical Specifications - Input/Output Devices
DA - 11975 Worldwide — Version 22 — June 6, 2005 Page 46