Chapter 1, Chapter 1: introduction, Introduction – Lanner LVC-5570 User Manual
Page 5: System specification
5
Introduction
Chapter 1
Embedded and Industrial Computing
Chapter 1:
Introduction
Thank you for choosing the LVC-5570. The LVC-5570 is
an ultra-robust embedded system which equips with
a suspension kit to eliminate shock and vibration. It is
designed to be installed on a moving transportation
system.
The system encompasses a wide variety of communication
ports to facilitate every possible in-vehicle applications
including surveillance, event data recorder and the GPS
receiver. It also features an external HDD drive bay for
easy insertion of the HDD/SSD. There is even an optional
audio port for voice communication through 3G wireless
service. The following list highlights the capabilities of
the LVC-5570 system:
One Digital I/O port for 4 digital input and 3 output
•
connections (via a DE-15 connector).
Two additional pins from the above Digital I/O can
•
be used for system wake-up to power on the system
automatically.
3G audio (optional) and PC audio ports
•
Rich I/O ports: 2 RS-232/422/485, 2 LAN ports, 6USB
•
ports (6 type A)
Triple Mini-PCIe connectors for 3G Internet services
•
(with 3 SIM card readers for 3G wireless Internet
connections) and an additional PCIe expansion
suitable for Wi-Fi connection.
Dual video display: DVI-D+VGA or HDMI+VGA output
•
with Intel® HD Graphics 3000
Power ignition control mechanism with programmable
•
on/off/delay switch
Wide range of DC power input from 9V to 36V, suitable
•
for vehicular 12V or 24V battery with Ignition control.
–Power input current protection by the 10A fuse and
15KP30A TVS
--12V DC output current protection by the 1A Polyfuse
Battery voltage protection: Over Voltage Protection
•
and Under Voltage Protection
Standby power consumption are well under 12V/81mA
and 24V/83mA
Extended operating temperature between -20 ~ 55 ºC
•
(-4 ~ 131ºF)
System Specification
Dimensions (WxHxD)
308x85.26x162mm
(12.13”x3.36”x6.38”)
Processor
Intel Core i7-2655LE Processors
Chipset
Intel HM65
System
Memory
Technology
DDR3 SO-DIMMx2
Max. Capacity
Up to 16GB
SATA
Removable 2.5” SSD/HDD drive
bayx2, on-board 8GB SSD
Ethernet Controller
Intel 82574Lx2
Graphic Controller
Intel integrated HD graphic engine
Audio Controller
ALC886
IO
LAN
GbE RJ45 x2
Display
DVI-D, maximum resolution up to
1920x1200@60Hz
VGA, maximum resolution up to
2048x1536@75Hz
HDMI, maximum resolution up to
1920x1200@60Hz
Audio
1x Mic-in and Line-out (for PC)
1x Mic-in and Line-out (for validated
Sierra MC-8090/8092 3G module)
via D-sub9
Serial I/O
2xRS-232/422/485 with RI/5V/12V
GPIO
4x DI 12V TTL level
3x DO 12V TTL level
2x DI (for MCU) 5V TTL Level
GPS
Ublox NEO-6Q GPS receiver module
G-sensor
ADXL 345
USB 2.0
Type A x6
Power Input
3-pin terminal block (+, -, ignition)
Expansion
Mini-PCIex4 with 3 SIM card readers
Others
External: 5x SMA antenna hole,
reset, Remote Power switch
9~36Vdc (max. 10A) output soft-
ware On/Off
Power Input
+9~36VDC input range, ATX mode
support ignition delay on/off
control
AC Adapter
Ordering Option
OS Support
Linux Kernel 2.6.18 or later
Windows XPE/WES2009, XP Pro
FES, WS7E, Win 7 Pro FES
Certifications
CE, FCC Class A, E13, RoHS
Compliance
Vibration: MIL-STD-810G, Method
514.6 with SSD and suspension kit
Shock: MIL-STD-810G, Method
516.6 with SSD and suspension kit