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Chapter 5, Chapter 5: hardware setup, Hardware setup – Lanner LVC-5570 User Manual

Page 29: Preparing the hardware installation

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29

Hardware Setup

Chapter 5

Embedded and Industrial Computing

Chapter 5:

Hardware Setup

Preparing the Hardware Installation

To access some components and perform certain service

procedures, you must perform the following procedures

first.

WARNING: To reduce the risk of personal injury,

electric shock, or damage to the equipment,

remove the power cord to remove power from

the server. The power switch button does not

completely shut off system power. Portions of the

power supply and some internal circuitry remain

active until power is removed.

Unpower the LVC-5570 and remove the power cord.

1.

Unscrew the 4 threaded screws from the top cover.

2.

Open the cover.

3.

Note:

If the CPU thermal pad mounting breaks apart,

use your hands to reattach the falling parts and

stick them together.

Installing the System Memory

The motherboard supports DDR3 memory to meet the

higher bandwidth requirements of the latest operating

system and Internet applications. It comes with two

Double Data Rate Three (DDR3) Small Outline Dual Inline

Memory Module (SO-DIMM) socket.

Align the memory module’s key with the SO-DIMM

1.

socket’s key.
Install the SO-DIMM.

2.

Note:

The system can support memory of DDR3 SO-

DIMM up to 16 GB in maximum with 2 SO-DIMM

sockets.

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