Vectronics VEC-1500K - Manual (Page 50)

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Lesson 7 Soldering Applications
1. For each PC board term (A-G), match a definition by number (1-7):
A. single-sided 1. several PC board layers sandwiched together
B. double-sided 2. conductive pathway between sides of a PC board
C. multi-layered 3. metalized component hole through PC board
D. plate-through 4. leadless surface-mounting component
E. via 5. any component hole through PC board
F. through-hole 6. PC board with two metalized surfaces
G. SMD 7. PC board with one metalized surface
A.____ B.____ C.____ D.____ E.____ F.____ G.____
2. "Raw" copper circuit board patterns are highly solderable, but must be
cleaned immediately before construction because of rapid
___________________ .
3. (T/F) The best way to melt solder onto a connection is to lightly touch the
tip of the iron with the solder wire. [ ]
4. When soldering to pc-board pads that aren't plated through, the primary
contact surface is the________________________.
5. When soldering to PC board pads that are plated through, the primary
contact area is the _______________________________.
6. Connections made using wire are called ____________ -to-
_____________ wiring.
7. When soldering wires onto a pc board: (A.) dress each lead so insulation is
close to the surface of the board. (B.) don't overheat and allow solder to
wick up the wires. (C.) install sleeving over exposed shields. (D.) all of the
above. [ ]
8. If a connection is poor, you'll probably see signs of ___________________,
a condition where the solderable surface resistings bonding with solder.
9. (T/F) The more solder you can deposit on the pad, the better the
connection--especially when working with plate-throughs. [ ]
10. A "cold solder joint" may result from: (A.) A joint disturbed in its "plastic"
phase while cooling. (B.) A connection where one surface was poorly
heated. (C.) A connection where solder failed to adhere due to oxidation.
(D.) All of the above. [ ]