Vectronics VEC-1500K - Manual (Page 32)

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Solder should melt, flow, and wet the surface of the lead and pad to form a
bright smooth connection. Rocking the iron slightly as solder flows will promote
better solder distribution around the connection.
Double-Sided Board, No Plate-Throughs: Most commercially manufactured
double-sided PC boards now have plate-through holes. However, hobby or
prototype boards may not! On two-sided boards, the major grounded-plane
surface is usually on the component side (top), and most of the interconnecting
tracks are on the solder side (bottom). To ensure good RF (radio frequency)
grounding, it's important to keep all ground connections on top as short as
possible (see below). If ceramic disc capacitors are used, carefully remove any
"flash" around the grounded lead prior to installation to exposure a solderable
surface. Make sure all vias are installed and soldered on both ends.
Solder
Flash Removed
Solder
Groundplane
Relief in groundplane
Bypass
Capacitor
Double-Sided (or Multilayered) Plate-Through Boards: The solder
technique for plate-through boards is different because the wall of the plate-
through hole (or eyelet) provides the contact surface for the component lead.
When installing parts in plate-throughs, it isn't necessary to bent leads tight
against the pad surface. Only bend enough to ensure the component remains
secured in place during soldering.
Plate-Through Eyelet
Bend to hold component
in place.