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Pin configurations, Pin definitions – Cypress CY14E256L User Manual

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CY14E256L

Document Number: 001-06968 Rev. *F

Page 2 of 18

Pin Configurations

Figure 1. Pin Diagram: 32-Pin SOIC/DIP

Pin Definitions

Pin Name

Alt

IO Type

Description

A

0

–A

14

Input

Address Inputs. Used to select one of the 32,768 bytes of the nvSRAM.

DQ

0

-DQ

7

Input or Output Bidirectional Data IO Lines. Used as input or output lines depending on operation.

WE

W

Input

Write Enable Input, Active LOW. When the chip is enabled and WE is LOW, data on the IO
pins is written to the specific address location.

CE

E

Input

Chip Enable Input, Active LOW. When LOW, selects the chip. When HIGH, deselects the chip.

OE

G

Input

Output Enable, Active LOW. The active LOW OE input enables the data output buffers during
read cycles. Deasserting OE HIGH causes the IO pins to tri-state.

V

SS

Ground

Ground for the Device. The device is connected to ground of the system.

V

CC

Power Supply

Power Supply Inputs to the Device.

HSB

Input or Output Hardware Store Busy (HSB). When LOW, this output indicates a Hardware Store is in progress.

When pulled low external to the chip, it initiates a nonvolatile STORE operation. A weak internal
pull up resistor keeps this pin high if not connected (connection optional).

V

CAP

Power Supply

AutoStore

Capacitor. Supplies power to nvSRAM during power loss to store data from SRAM

to nonvolatile elements.

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