Kontron KTA55-pITX - Manual (Page 36)

KTD-S0031-E Page 32 Power and Thermal Management
KTA55/pITX User's Guide
17 Power and Thermal Management
17.1 Cooling Options
A heat-spreader plate is already mounted. External cooling must be provided to maintain the heat-sprea-
der plate at proper operating temperatures. Under worst case conditions the cooling mechanism must
maintain an ambient air temperature of 60°C or less.
The aluminum slugs and thermal pads on the underside of the heat-spreader plate implement thermal
interfaces between the heat-spreader plate and the major heat generating components on the KTA55/pITX.
The optimum cooling solution varies - depending on the application and environmental conditions.
Attention: After the heat-sink has been mounted it cannot be removed anymore because after the warming up of the board the
thermal-foil between the both components will melt and bond the heat-sink to the heat-spreader plate.
17.2 C-State Control
The AMD ® Ontario platform has been implemented the control for dynamically starting and stopping system
clocks and power. The mapping between ACPI defined C-States and AMD ® specified C-State actions is not
direct. The actions when entering a C-State can be configured by software. The states are passing through
C0 (full on) to C6 one after another. The C-state ends when a break event occurs (e.g. an IRQ or SMI).