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Elecraft KNB2 Manual Errata User Manual

Elecraft Accessories communication

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E

l e c r a f t K N B 2 M A N U A L E R R A T A

R e v . D - 3 , F e b r u a r y 2 4 , 2 0 1 4

T H E F O L L O W I N G C H A N G E S T O T H E M A N U A L M U S T B E M A D E

B E F O R E P R O C E D I N G O R T H E K N B 2 W I L L N O T F U N C T I O N

C O R R E C T L Y

1. Page 2, Parts Inventory, U1 (third item from bottom): Change the description to read “RF Amplifier, SMD

on daughter board, SMT1A P/N E120013, with two 4-pin headers, P/N E620146”.

2. Page 4, second step: Delete reference to “U1”. (Only U3 will be installed at this time; U1 will be installed

later.)

3. Page 5, third step: Insert a note between the third and fourth steps to perform the following steps at this point

in the procedure:

Note: An RoHS compliant surface mount version of the MC1350 integrated circuit is
used at U1. This device is furnished pre-installed on a tiny printed circuit board that
mounts in the space originally provided for the 8-pin dual in-line (DIP) version of the
part.

Locate the SMT1A board and the two four-pin headers provided. Insert the

pins of the headers into the solder pads in the SMT1A board as shown below.

Position the SMT1A board and headers into the solder pads for MC1350 U1

as shown. Be sure pins 1 and 8 on the SMT1A board are at the end with the notch
shown in the outline on the KNB2 board.

i

When soldering the header pins, do not apply heat for more than two or

three seconds at a time to avoid melting the plastic header.

Pins 1 and 8

must be at

end above

the notch

outline on

the board

Solder
(8 places
on top)

Solder the pins on the bottom of the board. Solder a pin at opposite corners

first, then make sure the headers are resting against the board. If necessary re-
heat the pins while pressing the assembly against the KNB2 board. When the
assembly is in position, solder all 8 pins.

Continue with the assembly procedure at step four on page 5 of the KNB2

manual.