2 specifications – CH Tech EM405D User Manual
Page 8

2
1.2.2 Specifications
MAXIMUM RATINGS
Parameter
Condition
Rating
Units
Operating Temperature
0 to +60
C
Non-Operating Temperature
-40 to +75
C
Humidity
non-condensing
5 to 95
%
Input DC Power Level
12.6
V max.
Power Consumption
Support for two M-modules at full power
30
Watts
External Trigger Input
Power Off
Power On
± 40
± 36
V
V
CHARACTERISTICS
Limit
Parameter
Conditions
Min
Typ.
Max
Units
Data Transfers
Throughput
Wired Ethernet
– block read
1, 3
Wired Ethernet
– block write
2, 3
Wireless Ethernet
– block read
1, 3
Wireless Ethernet
– block write
2, 3
90K
40K
23K
14K
bytes/sec
bytes/sec
bytes/sec
bytes/sec
Input Power Supply
Level
DC
11.4
12.0
12.6
V
Current
for full M-module support
2.5
A
Ripple/noise
20MHz bandwidth
-1.5
+1.5
%
Power Consumption
Carrier
-0001 wired Ethernet
-0002 wireless Ethernet
460
500
470
510
550
590
mA
mA
M-modules (each position)
+5V
+12V
-12V
1.0
200
200
A
mA
mA
Triggers
Output Level
into a high impedance load
3.8
5.0
5.4
V
Output Impedance
50
Input Level
TLVL = 0
4
TLVL = 1
2.5
1.4
V
V
Input Impedance
TIMP = 0
4
TIMP = 1
100K
50
External Trigger Delay
External connector to M-module
M-module to external connector
M-module to M-module
30
30
30
40
40
40
ns
ns
ns
Cooling
Temperature Rise
20
°C
Temperature Accuracy
-2
+2
°C
Notes:
1. 12-24ms latency occurs on each command issued. The effect of this latency is reduced by transferring
large amounts of data with a single block read command. Maximum read throughput is achieved by
reading >64K bytes of data from a FIFO type register on an M-module using the Block Read
command. Host software may vary and can limit the maximum throughput.
2. The maximum number of bytes that can be written in a single block write command is 1024.
3. Ethernet is a non-deterministic communications interface. Realized throughput may be significantly
degraded by network activity or other factors that may affect network performance.
4. TLVL and TIMP refer to register bits in the Reset & Trigger Control register. Refer to section 4.3.5.