Maximum ratings, Operating range, Electrical characteristics – Cypress CY7C1329H User Manual
Page 8
CY7C1329H
Document #: 38-05673 Rev. *B
Page 8 of 16
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature ................................. –65
°C to +150°C
Ambient Temperature with
Power Applied............................................. –55
°C to +125°C
Supply Voltage on V
DD
Relative to GND ....... –0.5V to +4.6V
Supply Voltage on V
DDQ
Relative to GND ...... –0.5V to +V
DD
DC Voltage Applied to Outputs
in Tri-State............................................–0.5V to V
DDQ
+ 0.5V
DC Input Voltage ................................... –0.5V to V
DD
+ 0.5V
Current into Outputs (LOW) ........................................ 20 mA
Static Discharge Voltage ......................................... > 2001V
(per MIL-STD-883, Method 3015)
Latch-up Current ................................................... > 200 mA
Operating Range
Range
Ambient
Temperature
V
DD
V
DDQ
Commercial
0°C to +70°C
3.3V
–5%/+10%
2.5V –5%
to V
DD
Industrial
–40°C to +85°C
Electrical Characteristics
Over the Operating Range
[8, 9]
Parameter
Description
Test Conditions
Min.
Max.
Unit
V
DD
Power Supply Voltage
3.135
3.6
V
V
DDQ
I/O Supply Voltage
for 3.3V I/O
3.135
V
DD
V
for 2.5V I/O
2.375
2.625
V
V
OH
Output HIGH Voltage
for 3.3V I/O, I
OH
= –4.0 mA
2.4
V
V
for 2.5V I/O, I
OH
= –1.0 mA
2.0
V
V
V
OL
Output LOW Voltage
for 3.3V I/O, I
OL
= 8.0 mA
0.4
V
for 2.5V I/O, I
OL
= 1.0 mA
0.4
V
V
IH
Input HIGH Voltage
[8]
for 3.3V I/O
2.0
V
DD
+ 0.3V
V
for 2.5V I/O
1.7
V
DD
+ 0.3V
V
V
IL
Input LOW Voltage
[8]
for 3.3V I/O
–0.3
0.8
V
for 2.5V I/O
–0.3
0.7
V
I
X
Input Leakage Current
except ZZ and MODE
GND
≤ V
I
≤ V
DDQ
–5
5
µA
Input Current of MODE Input = V
SS
–30
µA
Input = V
DD
5
µA
Input Current of ZZ
Input = V
SS
–5
µA
Input = V
DD
30
µA
I
OZ
Output Leakage Current GND
≤ V
I
≤ V
DDQ,
Output Disabled
–5
5
µA
I
DD
V
DD
Operating Supply
Current
V
DD
= Max., I
OUT
= 0 mA,
f = f
MAX
= 1/t
CYC
6-ns cycle,166 MHz
240
mA
7.5-ns cycle,133 MHz
225
mA
I
SB1
Automatic CS
Power-down
Current—TTL Inputs
V
DD
= Max, Device
Deselected, V
IN
≥ V
IH
or
V
IN
≤ V
IL,
f = f
MAX
= 1/t
CYC
6-ns cycle, 166 MHz
100
mA
7.5-ns cycle,133 MHz
90
mA
I
SB2
Automatic CS
Power-down
Current—CMOS Inputs
V
DD
= Max, Device
Deselected, V
IN
≤ 0.3V or
V
IN
> V
DDQ
– 0.3V, f = 0
All speeds
40
mA
I
SB3
Automatic CS
Power-down
Current—CMOS Inputs
V
DD
= Max, Device
Deselected, or V
IN
≤ 0.3V
or V
IN
> V
DDQ
– 0.3V,
f = f
MAX
= 1/t
CYC
6-ns cycle, 166 MHz
85
mA
7.5-ns cycle,133MHz
75
mA
I
SB4
Automatic CS
Power-down
Current—TTL Inputs
V
DD
= Max, Device
Deselected, V
IN
≥ V
IH
or
V
IN
≤ V
IL
, f = 0
All speeds
45
mA
Notes:
8. Overshoot: V
IH
(AC) < V
DD
+1.5V (Pulse width less than t
CYC
/2), undershoot: V
IL
(AC) > –2V (Pulse width less than t
CYC
/2).
9. T
Power-up
: Assumes a linear ramp from 0v to V
DD
(min.) within 200 ms. During this time V
IH
< V
DD
and V
DDQ
< V
DD
.
10. Tested initially and after any design or process change that may affect these parameters.