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Software store, Software recall, Data protection – Cypress CY14B256L User Manual

Page 4: Noise considerations, Low average active power

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CY14B256L

Document Number: 001-06422 Rev. *H

Page 4 of 18

once again exceeds the sense voltage of V

SWITCH

, a RECALL

cycle is automatically initiated and takes t

HRECALL

to complete.

Software STORE

Data is transferred from the SRAM to the nonvolatile memory by
a software address sequence. The CY14B256L software
STORE cycle is initiated by executing sequential CE controlled
READ cycles from six specific address locations in exact order.
During the STORE cycle, an erase of the previous nonvolatile
data is first performed followed by a program of the nonvolatile
elements. When a STORE cycle is initiated, input and output are
disabled until the cycle is completed.

Because a sequence of READs from specific addresses is used
for STORE initiation, it is important that no other READ or WRITE
accesses intervene in the sequence. If they intervene, the
sequence is aborted and no STORE or RECALL takes place.

To initiate the software STORE cycle, the following READ
sequence is performed:

1. Read address 0x0E38, Valid READ

2. Read address 0x31C7, Valid READ

3. Read address 0x03E0, Valid READ

4. Read address 0x3C1F, Valid READ

5. Read address 0x303F, Valid READ

6. Read address 0x0FC0, Initiate STORE cycle

The software sequence is clocked with CE controlled READs or
OE controlled READs. When the sixth address in the sequence
is entered, the STORE cycle commences and the chip is
disabled. It is important that READ cycles and not WRITE cycles
are used in the sequence. It is not necessary that OE is LOW for
a valid sequence. After the t

STORE

cycle time is fulfilled, the

SRAM is again activated for READ and WRITE operation.

Software RECALL

Data is transferred from the nonvolatile memory to the SRAM by
a software address sequence. A software RECALL cycle is
initiated with a sequence of READ operations in a manner similar
to the software STORE initiation. To initiate the RECALL cycle,
the following sequence of CE controlled READ operations is
performed:

1. Read address 0x0E38, Valid READ

2. Read address 0x31C7, Valid READ

3. Read address 0x03E0, Valid READ

4. Read address 0x3C1F, Valid READ

5. Read address 0x303F, Valid READ

6. Read address 0x0C63, Initiate RECALL cycle

Internally, RECALL is a two step procedure. First, the SRAM data
is cleared, and then the nonvolatile information is transferred into
the SRAM cells. After the t

RECALL

cycle time, the SRAM is once

again ready for READ and WRITE operations. The RECALL
operation does not alter the data in the nonvolatile elements. The
nonvolatile data can be recalled an unlimited number of times.

Data Protection

The CY14B256L protects data from corruption during low
voltage conditions by inhibiting all externally initiated STORE
and WRITE operations. The low voltage condition is detected
when V

CC

is less than V

SWITCH

. If the CY14B256L is in a WRITE

mode (both CE and WE are low) at power up after a RECALL or
after a STORE, the WRITE is inhibited until a negative transition
on CE or WE is detected. This protects against inadvertent writes
during power up or brown out conditions.

Noise Considerations

The CY14B256L is a high speed memory. It must have a high
frequency bypass capacitor of approximately 0.1 µF connected
between V

CC

and V

SS,

using leads and traces that are as short

as possible. As with all high speed CMOS ICs, careful routing of
power, ground, and signals reduce circuit noise.

Low Average Active Power

CMOS technology provides the CY14B256L the benefit of
drawing significantly less current when it is cycled at times longer
than 50 ns.

Figure 3

shows the relationship between I

CC

and

READ or WRITE cycle time. Worst case current consumption is
shown for both CMOS and TTL input levels (commercial temper-
ature range, VCC = 3.6V, 100% duty cycle on chip enable). Only
standby current is drawn when the chip is disabled. The overall
average current drawn by the CY14B256L depends on the
following items:

The duty cycle of chip enable

The overall cycle rate for accesses

The ratio of READs to WRITEs

CMOS versus TTL input levels

The operating temperature

The V

CC

level

IO loading

Figure 3. Current vs. Cycle Time

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