Rockwell Automation 1492-CM800-LD001 Field Wire Conv. Module for Modicon B802-008 to 1756-OA8 User Manual
Page 6
Specification
Value
Dimensions
288.9 mm (height) x 139.7 mm (depth) x 44.5 mm (width)
11.37 in. (height) x 5.5 in. (depth) x 1.75 in. (width)
Approximate Shipping Weight
300g (0.66 lbs) (includes carton)
Storage Temperature
-40 to +85°C (-40 to +185°F)
Operating Temperature
0 to 55°C (32 to 131°F)
Operating Humidity
5 to 95% at 55°C (non-condensing)
Shock
Non-operating
Operating
50g
30g
Operating Vibration
2g @ 10-500Hz
Maximum Operating Voltage
125Vac at 47 to 63Hz
Max. Module Operating Current
Per Point:
Per Module:
2 Amps (1492-CABLE connection pins are limited to 2A per pin)
12 Amps
Agency Certifications
UL Classified: Under UL File Number E113724
Fusing
Two, 4 Amps, 5 x 20 mm
CSA
CE: compliant for all applicable directives
Pollution Degree
2
Environmental Rating
IP20
10000021848
(Version 00)
Printed in Germany
Article No. 4351840000
VII. 1492-CM800-LD001 Conversion Module Specifications
(Operating specifications are when installed in the Conversion System base / cover-plate assembly)
VIII. Appendix A - 800 Housing to 1756 Chassis Conversion System Selection Process
1) Determine the number of 800 I/O modules actually used in the 800 I/O Housing to be converted to 1756 I/O .
2) Review the data in Column 5 from the below table, and select a 1756 I/O Chassis which meets your conversion
needs from Step 1. Ensure the information from the I/O Conversion module table is reviewed first since in some
cases, two 1756 modules are needed to replace one 800 I/O module.
3) Once the 1756 Chassis is selected, refer to Column 7 and select the Conversion Assembly.
One chassis slot required for the ControlLogix processor or a remote I/O adapter type module.
The footprint and mounting dimensions of the 1492 Conversion Assembly (base-plate and cover-plate) match those of the
Modicon I/O Housing.
Width dimension includes the 1756 Chassis power supply.
Surplus Chassis width as compared to the 800 I/O Housing is divided equally when mounting it on the Conversion Assembly.
Mounting holes for the 1756 I/O Chassis are pre-drilled and pre-tapped into the Conversion Assembly cover-plate.
Modicon is a Registered Trademark of Group Schneider.
AS-H810-xxx
AS-H819-103
AS-H819-209
AS-H819-100
AS-H827-103
AS-H827-209
AS-B827-100
Modicon 800 I/O
Housing Cat Number
1492-MUA4-MB3
1492-MUA7-A10-
MB4679
1492-MUA10-A13-
MB81011
Conversion Assembly
Catalog Number
Max. Number
of 800 Housing
Slots for I/O
3
4
6
7
8
10
11
10.25”
17.5”
17.5”
17.5”
27.1”
27.1”
27.1”
800 Housing
Width
Dimension
10.25”
A7 = 14.49”
A10 = 19.02”
A7 = 14.49”
A10 = 19.02”
A7 = 14.49”
A10 = 19.02”
A10 = 19.02”
A13 = 23.15”
A10 = 19.02”
A13 = 23.15”
A10 = 19.02”
A13 = 23.15”
1756 Chassis
Width
Dimension
Max. Number
of 1756 Chassis
Slots for I/O
3
A7 = 6, A10=9
A7 = 6, A10=9
A7 = 6, A10=9
A10 = 9, A13=12
A10 = 9, A13=12
A10 = 9, A13=12
1756 I/O Chassis
Catalog Number
1
7
2
3
6
5
4
1756-A4
1756-A7
or
1756-A10
1756-A10
or
1756-A13
Refer to the Wiring Diagram(s) for
current limits for a specific configuration.
NOTICE