Cirrus Logic CS5381 - Manual (Page 13)

DS563F2 13
CS5381
DC ELECTRICAL CHARACTERISTICS
(GND = 0 V, all voltages with respect to ground. MCLK=12.288 MHz; Master Mode)
8. Power-Down Mode is defined as RST = Low with all clocks and data lines held static.
9. Valid with the recommended capacitor values on FILT+ and VQ as shown in the Typical Connection
Diagram.
DIGITAL CHARACTERISTICS
THERMAL CHARACTERISTICS
Parameter Symbol Min Typ Max Unit
Power Supply Current VA = 5 V
(Normal Operation) VL,VD = 5 V
VL,VD = 3.3 V
I
A
I
D
I
D
-
-
- 36
36
24 43
46
28 mA
mA
mA
Power Supply Current VA = 5 V
(Power-Down Mode) (Note 8) VL,VD = 5 V
I
A
I
D
-
- 100
100 -
- uA
uA
Power Consumption
(Normal Operation)
VA, VL, VD = 5 V
VA = 5 V; VL, VD = 3.3 V
(Power-Down Mode)
-
-
- -
-
- 360
260
1
445
307
-
mW
mW
mW
Power Supply Rejection Ratio (1 kHz) (Note 9) PSRR - 65 - dB
V
Q
Nominal Voltage
Output Impedance
Maximum allowable DC current source/sink
-
-
- 2.5
25
0.01
-
-
- V
k
Ω
mA
Filt+ Nominal Voltage
Output Impedance
Maximum allowable DC current source/sink
-
-
- 5
4.5
0.01
-
-
- V
k
Ω
mA
Parameter Symbol Min Typ Max Units
High-Level Input Voltage (% of VL) V
IH
70% - - V
Low-Level Input Voltage (% of VL) V
IL
- - 30% V
High-Level Output Voltage at I
o
= 100 µA (% of VL) V
OH
70% - - V
Low-Level Output Voltage at I
o
= 100 µA (% of VL) V
OL
- - 15% V
OVFL Current Sink I
ovfl
- - 4.0 mA
Input Leakage Current I
in
-10 - 10
µA
Parameter Symbol Min Typ Max Unit
Allowable Junction Temperature - - 135 °C
Junction to Ambient Thermal Impedance
(Multi-layer PCB) TSSOP
(Multi-layer PCB) SOIC
(Single-layer PCB) TSSOP
(Single-layer PCB) SOIC
θ
JA-TM
θ
JA-SM
θ
JA-TS
θ
JA-SS
-
-
-
- 70
60
105
80
-
-
-
-
°C/W
°C/W
°C/W
°C/W