Probing alternatives – Atec Agilent-1670G User Manual
Page 17
17
Probing the device under test is
both one of the potentially most
difficult and certainly one of
the most important tasks in
debugging a digital design. That
is why Agilent Technologies
provides a wider variety of
probing solutions than anyone
else in the industry—each with a
different set of advantages
particular to a given situation. We
like to think of it as helping you
get your signals off to a great
start.
Probing Alternatives
Probing Alternative
Advantages
Limitations
General-Purpose
Most flexible method. Works in
Can be cumbersome
Lead Sets and Surface
conjunction with SMD clips and Wedge
when connecting
Mount IC Clips
adapters listed below. Included with
a large number
(Figure 16 and 17)
logic analyzer purchase.
of channels.
Ultra-Fine Pitch Surface
Smallest IC clips in the industry to date
Same as above plus
Mount Device Clips
(down to 0.5 mm). Works with both logic
small incremental cost.
(Figure 18)
analyzer and scope probing systems. _
Wedge probe adapter
Compressible dual conductors between
Same as above plus
for QFP Packages
adjacent IC legs make 3-16 adjacent signal
small incremental cost.
(Figure 19)
leads available to logic analyzer and
scope probing systems.
Elastomeric and Locator
Provides access to all signal leads for
Requires minimal
Base Solutions for Generic
generic QFP packages (including custom
keep out area.
QFP Packages
ICs). Uses combination of one probe
Moderate to significant
(Figure 20)
adapter and four flexible adapters, plus
incremental cost.
general-purpose lead sets.
Direct Connection to
Very reliable and convenient probing
Requires advance
Device Under Test via
system when frequent probing
planning to integrate
Built-In Connectors
connections are required (manufacturing
into design process.
(Figure 21 and 22)
or field test for example). Connectors
Moderate (normal
can be located at optimal position in
density) to significant
the device under test. Can work in
(high density)
conjunction with Agilent provided
incremental cost.
inverse assemblers.
Analysis Probes
Support for over 200 different
Requires moderate
for Specific Processors
processors and buses. Includes
clearance around
and Buses
reliable logic analyzer probe
processor or bus.
pod connectors, logic analyzer
Moderate to significant
configuration files and device
extra cost depending on
specific inverse assemblers.
specific processor or bus.
Figure 16. General-Purpose Lead Sets
Figure 17. Surface Mount IC Clips
Figure 18. Ultra-Fine Pitch Surface Mount
Device Clips
Figure 19. Agilent Wedge Probe Adapters for
QFP Package
Agilent Wedge Probe Adapter
IC leg spacing
Number of signals
Number of wedges in pack
Model number
0.5 mm
3
1
E2613A
0.5 mm
3
2
E2613B
0.5 mm
8
1
E2614A
0.5 mm
16
1
E2643A
0.65 mm
3
1
E2615A
0.65 mm
3
2
E2615B
0.65 mm
8
1
E2616A
0.65 mm
16
1
E2644A