Diodes ZXGD3105N8 - Manual (Page 3)

ZXGD3105N8
Document Number DS35101 Rev. 3 - 2
3 of 14
www.diodes.com
March 2013
© Diodes Incorporated
A Product Line of
Diodes Incorporated
ZXGD3105N8
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit
Supply voltage, relative to GND V
CC
25 V
Drain pin voltage V
D
-3 to +100 V
Gate output voltage V
G
-3 to V
CC
+3 V
Gate Driver peak source current I
SOURCE
4 A
Gate Driver peak sink current I
SINK
9 A
Reference voltage V
REF
V
CC
V
Reference current I
REF
25 mA
Bias voltage V
BIAS
V
CC
V
Bias current I
BIAS
100 mA
Thermal Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit
Power Dissipation
Linear derating factor
(Note 5)
P
D
490
3.92
mW
mW/°C
(Note 6)
655
5.24
(Note 7)
720
5.76
(Note 8)
785
6.28
Thermal Resistance, Junction to Ambient
(Note 5)
R
θJA
255
°C/W
(Note 6) 191
(Note 7) 173
(Note 8) 159
Thermal Resistance, Junction to Lead (Note 9) R
θJL
55 °C/W 
Thermal Resistance, Junction to Case (Note 10) R
θJC
45 °C/W
Operating Temperature Range T
J
-40 to +150
°C
Storage Temperature Range T
STG
-50 to +150
ESD Ratings
(Note 11)
Characteristic Symbol Value Unit JEDEC Class
Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A
Electrostatic Discharge - Machine Model ESD MM 200 V B
Notes: 5. For a device surface mounted on minimum recommended pad layout FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the
device is measured when operating in a steady-state condition.
6. Same as note (5), except pin 1 (V
CC
) and pin 7 (GND) are both connected to separate 5mm x 5mm 1oz copper heatsinks.
7. Same as note (6), except both heatsinks are 10mm x 10mm.
8. Same as note (6), except both heatsinks are 15mm x 15mm.
9. Thermal resistance from junction to solder-point at the end of each lead on pin 1 (V
CC
) or pin 7 (GND).
10. Thermal resistance from junction to top of the case.
11. Refer to JEDEC specification JESD22-A114 and JESD22-A115.