Littelfuse SP3012 Series - Manual (Page 7)

7 ©2013 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays
(SPA ® Diodes)
Revision: 09 2, 13
SP3012 Series
SP30
1
2
Low Capacitance ESD Protection - SP3012 Series
Package Dimensions — µDFN-14 (3.5x1.35x0.5mm)
µDFN-14 (3.5x1.35x0.5mm)
JEDEC MO-229
Symbol
Millimeters Inches
Min Nom Max Min Nom Max
A 0.45 0.50 0.55 0.018 0.020 0.022
A1 0.00 0.02 0.05 0.000 0.001 0.002
A2 0.203 Ref 0.008 Ref
b 0.15 0.20 0.25 0.006 0.008 0.012
D 3.40 3.50 3.60 0.134 0.138 0.142
D2 - - - - - -
E 1.25 1.35 1.45 0.050 0.054 0.058
E1 - - - - - -
e 0.500 BSC 0.020 BSC
L 0.25 0.30 0.35 0.010 0.012 0.014
D
E
B
Top View
A
Bottom View
Side View
PIN 1 Index Area 1 2 3 4
A
C b
A1 A2
Seating
Plane
Pin 1 Identification
Chamfer 0.10X45º Notes:
1. Dimension and tolerancing comform to ASME Y14.5M-1994.
2. Controlling dimensions: Millimeter. Converted Inch dimensions are not necessarily
exact.
Soldering Pad Layout
Recomended
Symbol Millimeter Inches
Soldering Pad Layout Dimensions
Symbol
Millimeters Inches
Min Nom Max Min Nom Max
D 3.29 3.30 3.31 0.1295 0.1299 0.1303
E 1.44 1.45 1.46 0.0567 0.0571 0.0575
b 0.29 0.30 0.31 0.0114 0.0118 0.0122
L 0.39 0.40 0.41 0.0154 0.0158 0.0161
e 0.50 typ 0.020 typ
s 0.19 0.20 0.21 0.0075 0.0078 0.0083
s1 0.64 0.65 0.66 0.0252 0.0256 0.0260
Embossed Carrier Tape & Reel Specification — µDFN-14
Symbol Millimeters
A0 1.58 +/- 0.10
B0 3.73 +/- 0.10
D0 0.60 + 0.05
D1 Ø 0.60 + 0.05
E 1.75 +/- 0.10
F 5.50 +/- 0.05
K0 0.68 +/- 0.10
P0 2.00 +/- 0.05
P1 4.00 +/- 0.10
P2 4.00 +/- 0.10
T 0.28 +/- 0.02
W 12.00 + 0.30 /- 0.10
P0
D0
E
F
P1
P2
D1
W
T
B0
K0
A0
User Feeding Direction
Pin 1 Location