Littelfuse SP1002 Series - Manual (Page 3)

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/10/13
TVS Diode Arrays
(SPA ® Diodes)
General Purpose ESD Protection - SP1002 Series
Package Dimensions — SC70-3
B
3
E HE
2 1
e e
D
A2 A
A1
C
L
1.30
[0.0512]
0.65
[0.0256]
0.70
[0.0276]
1.90
[0.0748]
0.90
[0.0354]
Package SC70-3
Pins 3
JEDEC MO-203
Millimeters Inches
Min Max Min Max
A 0.80 1.10 0.031 0.043
A1 0.00 0.10 0.000 0.004
A2 0.70 1.00 0.028 0.039
B 0.15 0.30 0.006 0.012
c 0.08 0.25 0.003 0.010
D 1.85 2.25 0.073 0.089
E 1.15 1.35 0.045 0.053
e 0.66 BSC 0.026 BSC
HE 2.00 2.40 0.079 0.094
L 0.26 0.46 0.010 0.018
Solder Pad Layout
Package Dimensions — SC70-5
D
A2 A
A1
C
L
E HE
2 1 3
6 5
not used
4
e e
B
Package SC70-5
Pins 5
JEDEC MO-203
Millimeters Inches
Min Max Min Max
A 0.80 1.10 0.031 0.043
A1 0.00 0.10 0.000 0.004
A2 0.70 1.00 0.028 0.039
B 0.15 0.30 0.006 0.012
c 0.08 0.25 0.003 0.010
D 1.85 2.25 0.073 0.089
E 1.15 1.35 0.045 0.053
e 0.65 BSC 0.026 BSC
HE 2.00 2.40 0.079 0.094
L 0.26 0.46 0.010 0.018
Solder Pad Layout
Product Characteristics
Lead Plating Matte Tin
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.