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Tvs diode arrays, General purpose esd protection - sp1002 series, Diodes) – Littelfuse SP1002 Series User Manual

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© 2013 Littelfuse, Inc.

Specifications are subject to change without notice.

Revised: 10/10/13

TVS Diode Arrays

(SPA

®

Diodes)

General Purpose ESD Protection - SP1002 Series

Electrical Characteristics (T

OP

= 25°C)

Parameter

Symbol

Test Conditions

Min

Typ

Max

Units

Voltage Drop

V

D

I

R

=1mA

6.0

9.5

V

Reverse Standoff Voltage

V

RWM

I

R

≤1µA with 1 I/O at GND

6.0

V

Leakage Current

I

LEAK

V

R

=5V with I/O at GND

0.5

µA

Clamp Voltage

1

V

C

I

PP

=1A, t

p

=8/20µs, Fwd

9.2

13.0

V

I

PP

=2A, t

p

=8/20µs, Fwd

11.2

16.0

V

Dynamic Resistance

R

DYN

(V

C2

- V

C1

) / (I

PP2

- I

PP1

)

2.0

Ω

ESD Withstand Voltage

1,2

V

ESD

IEC61000-4-2 (Contact)

±8

kV

IEC61000-4-2 (Air)

±15

kV

Diode Capacitance

1

C

D

Reverse Bias=0V

6

pF

Reverse Bias=2.5V

5

pF

Reverse Bias=5V

5

pF

Notes:

1

Parameter is guaranteed by device characterization

2

A minimum of 1,000 ESD pulses are applied at 1s intervals

Thermal Information

Parameter

Rating

Units

Storage Temperature Range

–55 to 150

°C

Maximum Junction Temperature

150

°C

Maximum Lead Temperature

(Soldering 20-40s)

260

°C

Absolute Maximum Ratings

Symbol

Parameter

Value

Units

I

PP

Peak Current (t

p

=8/20μs)

2

A

T

OP

Operating Temperature

–40 to 125

°C

T

STOR

Storage Temperature

–55 to 150

°C

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.

Time

Te

mperatur

e

T

P

T

L

T

S(max)

T

S(min)

25

t

P

t

L

t

S

time to peak temperature

Preheat

Preheat

Ramp-up

Ramp-up

Ramp-down

Ramp-do

Critical Zone

T

L

to T

P

Critical Zone

T

L

to T

P

Reflow Condition

Pb – Free assembly

Pre Heat

- Temperature Min (T

s(min)

)

150°C

- Temperature Max (T

s(max)

)

200°C

- Time (min to max) (t

s

)

60 – 180 secs

Average ramp up rate (Liquidus) Temp
(T

L

) to peak

3°C/second max

T

S(max)

to T

L

- Ramp-up Rate

3°C/second max

Reflow

- Temperature (T

L

) (Liquidus)

217°C

- Temperature (t

L

)

60 – 150 seconds

Peak Temperature (T

P

)

260

+0/-5

°C

Time within 5°C of actual peak
Temperature (t

p

)

20 – 40 seconds

Ramp-down Rate

6°C/second max

Time 25°C to peak Temperature (T

P

)

8 minutes max.

Do not exceed

260°C

Soldering Parameters