Tvs diode arrays, General purpose esd protection - sp1002 series, Diodes) – Littelfuse SP1002 Series User Manual
Page 2

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/10/13
TVS Diode Arrays
(SPA
®
Diodes)
General Purpose ESD Protection - SP1002 Series
Electrical Characteristics (T
OP
= 25°C)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
Voltage Drop
V
D
I
R
=1mA
6.0
9.5
V
Reverse Standoff Voltage
V
RWM
I
R
≤1µA with 1 I/O at GND
6.0
V
Leakage Current
I
LEAK
V
R
=5V with I/O at GND
0.5
µA
Clamp Voltage
1
V
C
I
PP
=1A, t
p
=8/20µs, Fwd
9.2
13.0
V
I
PP
=2A, t
p
=8/20µs, Fwd
11.2
16.0
V
Dynamic Resistance
R
DYN
(V
C2
- V
C1
) / (I
PP2
- I
PP1
)
2.0
Ω
ESD Withstand Voltage
1,2
V
ESD
IEC61000-4-2 (Contact)
±8
kV
IEC61000-4-2 (Air)
±15
kV
Diode Capacitance
1
C
D
Reverse Bias=0V
6
pF
Reverse Bias=2.5V
5
pF
Reverse Bias=5V
5
pF
Notes:
1
Parameter is guaranteed by device characterization
2
A minimum of 1,000 ESD pulses are applied at 1s intervals
Thermal Information
Parameter
Rating
Units
Storage Temperature Range
–55 to 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature
(Soldering 20-40s)
260
°C
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
I
PP
Peak Current (t
p
=8/20μs)
2
A
T
OP
Operating Temperature
–40 to 125
°C
T
STOR
Storage Temperature
–55 to 150
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Time
Te
mperatur
e
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
Preheat
Preheat
Ramp-up
Ramp-up
Ramp-down
Ramp-do
Critical Zone
T
L
to T
P
Critical Zone
T
L
to T
P
Reflow Condition
Pb – Free assembly
Pre Heat
- Temperature Min (T
s(min)
)
150°C
- Temperature Max (T
s(max)
)
200°C
- Time (min to max) (t
s
)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
L
) to peak
3°C/second max
T
S(max)
to T
L
- Ramp-up Rate
3°C/second max
Reflow
- Temperature (T
L
) (Liquidus)
217°C
- Temperature (t
L
)
60 – 150 seconds
Peak Temperature (T
P
)
260
+0/-5
°C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (T
P
)
8 minutes max.
Do not exceed
260°C
Soldering Parameters